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公开(公告)号：US09256038B2
公开(公告)日：2016-02-09
申请号：US14724147
申请日：2015-05-28
Inventor： Young-Tak Han , Jang Uk Shin , Sang-Pil Han , Sang Ho Park , Yongsoon Baek
CPC classification number: G02B6/4279 , G02B6/12002 , G02B6/12004 , G02B6/325 , G02B6/42 , G02B6/4201 , G02B6/4206 , G02B6/4208 , G02B6/4257 , G02B6/4265 , G02B6/4271 , G02B6/428 , G02B6/4281 , G02B2006/12092 , G02B2006/12135
Abstract: Provided is an optical module. The optical module includes: an optical bench having a first trench of a first depth and a second trench of a second depth that is lower than the first depth; a lens in the first trench of the optical bench; at least one semiconductor chip in the second trench of the optical bench; and a flexible printed circuit board covering an upper surface of the optical bench except for the first and second trenches, wherein the optical bench is a metal optical bench or a silicon optical bench.
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2.发明申请STRUCTURE FOR CONNECTING ELECTRICAL TRACE LINES OF PRINTED CIRCUIT BOARDS AND OPTICAL TRANSCEIVER MODULE WITH THE SAME 有权用于连接印刷电路板的电线和与其相结合的光收发器模块的结构公开(公告)号：US20140147128A1
公开(公告)日：2014-05-29
申请号：US13910213
申请日：2013-06-05
Inventor： Young-Tak Han , Jang Uk Shin , Sang Ho Park , Yongsoon Baek
CPC classification number: H05K1/0251 , H05K1/0219 , H05K1/0221 , H05K1/141 , H05K1/142 , H05K1/144 , H05K1/145 , H05K1/181 , H05K2201/09236 , H05K2201/09618 , H05K2201/09727 , H05K2201/10121
Abstract: Provided are structures for connecting trace lines of printed circuit boards and optical transceiver modules with the same. The module may include an optical transmitter/receiver part, a signal processing unit, a flexible PCB, and a rigid PCB. The flexible PCB may include a first signal line, and the rigid PCB may include a second signal line. The flexible PCB and the rigid PCB may be overlapped with each other. The first signal line and the second signal line may not be overlapped with each other and be electrically connected to each other by a junction soldering structure. It is possible to transmit high quality and high frequency signals through the first and second signal lines.
Abstract translation: 提供了用于连接印刷电路板的轨迹线和具有该印刷电路板的光收发器模块的结构。 该模块可以包括光发射器/接收器部分，信号处理单元，柔性PCB和刚性PCB。 柔性PCB可以包括第一信号线，并且刚性PCB可以包括第二信号线。 柔性PCB和刚性PCB可以彼此重叠。 第一信号线和第二信号线可以彼此不重叠并且通过连接焊接结构彼此电连接。 可以通过第一和第二信号线传输高质量和高频信号。
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公开(公告)号：US20230073881A1
公开(公告)日：2023-03-09
申请号：US17852173
申请日：2022-06-28
Inventor： Hyun Soo KIM , Duk Jun Kim , Dong-Young Kim , Ho Sung Kim , Youngsoon Baek , Jang Uk Shin , Young-Tak Han , Won Seok Han
Abstract: Disclosed are a Mach-Zehnder interferometric optical modulator and a method for manufacturing the same. The modulator includes first and second lower clad layers, a core layer, an upper clad layer, a waveguide, and electrodes. The waveguide may include an input waveguide, a waveguide divider, branch waveguides, and a waveguide combiner. Each of the branch waveguides includes first and second connection regions connected to the waveguide combiner and the waveguide divider, respectively, and a phase shift region having a cross-section of a reverse mesa structure that has an upper width that is the same as widths of the first and second connection regions and a lower width that is smaller than the widths of the first and second connection regions.
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公开(公告)号：US10268004B2
公开(公告)日：2019-04-23
申请号：US15869226
申请日：2018-01-12
Inventor： Young Tak Han , Sang Ho Park , Yong Soon Baek , Jang Uk Shin , Yong Hwan Kwon , Jong Hoi Kim
Abstract: Provided herein are a multi-channel receiver optical sub-assembly and a manufacturing method thereof. The multi-channel receiver optical sub-assembly includes a PLC chip having a first side into which an optical signal is received and a second side from which the received signal is outputted, with an inclined surface formed on the second side of the PLC chip at a preset angle, a PD carrier bonded onto the PLC chip and made of a glass material, and an SI-PD bonded onto the PD carrier, a lens being integrated therein. The PLC chip, the PD carrier, and the SI-PD are passively aligned by at least one alignment mark and then are bonded.
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公开(公告)号：US09411097B2
公开(公告)日：2016-08-09
申请号：US14727751
申请日：2015-06-01
Inventor： Young Tak Han , Sang Ho Park , Yong Soon Baek , Jang Uk Shin
CPC classification number: G02B6/12019 , G02B6/4251 , G02B6/4279
Abstract: Provided herein is an optical module including an optical bench having a first step with a first depth and a second step with a second depth that is smaller than the first depth; a silicon carrier disposed above the first step, and where at least one semiconductor chip is installed; an AWG chip (Arrayed Waveguide Grating chip) secured to the second step, extends up to the first step, and is chip-to-chip bonded with the silicon carrier above the first step; a lens disposed on an upper surface of the optical bench where the first step and the second step are not formed; and a metal package surrounding the optical bench, silicon carrier, AWG chip and lens, wherein at one side of the metal package, a double slit that includes an upper slit and a lower slit are formed, a DC FPCB (Direct Current FPCB) extends from outside towards inside the metal package through the upper slit and is secured to a support formed on an inner surface of the upper slit, and an RF FPCB (Radio Frequency FPCB) extends from outside towards inside the metal package through the lower slit and is secured to an upper portion of the silicon carrier, and the upper slit and the lower slit of the double slit being sealed by an elastic epoxy.
Abstract translation: 本文提供了一种光学模块，其包括具有第一深度的第一步骤和具有小于第一深度的第二深度的第二步骤的光学台架; 设置在所述第一台阶上方的硅载体，并且其中安装有至少一个半导体芯片; 固定到第二步的AWG芯片（阵列波导光栅芯片）延伸到第一步，并且在第一步骤之上与硅载体进行芯片到芯片的接合; 透镜，设置在光学台的上表面，其中没有形成第一步骤和第二步骤; 以及围绕光学台，硅载体，AWG芯片和透镜的金属封装，其中在金属封装的一侧形成包括上缝和下缝的双缝，DC FPCB（直流FPCB）延伸 从金属包装的外部通过上部狭缝固定到形成在上部狭缝的内表面上的支撑件上，并且RF FPCB（射频FPCB）通过下部狭缝从外部向金属包装内部延伸，并且是 固定到硅载体的上部，双缝的上缝和下狭缝由弹性环氧树脂密封。
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Patent Agency Ranking
公开(公告)号：US12072600B2
公开(公告)日：2024-08-27
申请号：US17852173
申请日：2022-06-28
Inventor： Hyun Soo Kim , Duk Jun Kim , Dong-Young Kim , Ho Sung Kim , Yongsoon Baek , Jang Uk Shin , Young-Tak Han , Won Seok Han
Abstract: Disclosed are a Mach-Zehnder interferometric optical modulator and a method for manufacturing the same. The modulator includes first and second lower clad layers, a core layer, an upper clad layer, a waveguide, and electrodes. The waveguide may include an input waveguide, a waveguide divider, branch waveguides, and a waveguide combiner. Each of the branch waveguides includes first and second connection regions connected to the waveguide combiner and the waveguide divider, respectively, and a phase shift region having a cross-section of a reverse mesa structure that has an upper width that is the same as widths of the first and second connection regions and a lower width that is smaller than the widths of the first and second connection regions.
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公开(公告)号：US09904023B2
公开(公告)日：2018-02-27
申请号：US15203737
申请日：2016-07-06
Inventor： Young Tak Han , Sang Ho Park , Yong Soon Baek , Jang Uk Shin , Yong Hwan Kwon , Jong Hoi Kim
CPC classification number: G02B6/4224 , G01J1/0209 , G01J1/44 , G01J3/0259 , G01J2001/444 , G02B6/12019 , G02B6/4239 , G02B6/4257 , G02B6/4279 , G02B6/4281 , H04B10/60
Abstract: Provided herein are a multi-channel receiver optical sub-assembly and a manufacturing method thereof. The multi-channel receiver optical sub-assembly includes a PLC chip having a first side into which an optical signal is received and a second side from which the received signal is outputted, with an inclined surface formed on the second side of the PLC chip at a preset angle, a PD carrier bonded onto the PLC chip and made of a glass material, and an SI-PD bonded onto the PD carrier, a lens being integrated therein. The PLC chip, the PD carrier, and the SI-PD are passively aligned by at least one alignment mark and then are bonded.
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公开(公告)号：US09711939B2
公开(公告)日：2017-07-18
申请号：US15241362
申请日：2016-08-19
Inventor： Dong Hun Lee , Sang Ho Park , Yong Soon Baek , Jang Uk Shin , Young Tak Han
IPC: G02B6/12 , H01S5/22 , H01S5/026 , H01S5/00 , H01S5/343 , G02F1/017 , G02B6/14 , G02B6/122 , G02F1/015
CPC classification number: H01S5/026 , G02B6/12004 , G02B6/1228 , G02B6/14 , G02B2006/12097 , G02F1/01708 , G02F2001/0157 , H01S5/0064 , H01S5/0085 , H01S5/0265 , H01S5/1014 , H01S5/12 , H01S5/2223 , H01S5/227 , H01S5/3235 , H01S5/343
Abstract: Provided herein is a semiconductor optical device, including a waveguide including lattices buried therein and having a buried hetero (BH) structure formed in an optical oscillation region in which single mode light is oscillated, a waveguide having a deep ridge structure formed in an optical modulation region, and a passive waveguide formed in a mode transition region interposed between the optical oscillation region and the optical modulation region, formed as a connecting structure of the waveguide having the BH structure extending from the optical oscillation region and the waveguide having the deep ridge structure extending from the optical modulation region, and inducing evanescent optical coupling, wherein a width of the waveguide having the BH structure in the mode transition region is smaller than a width of the waveguide having the deep ridge structure in the optical modulation region.
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9.发明授权公开(公告)号：US09265140B2
公开(公告)日：2016-02-16
申请号：US13910213
申请日：2013-06-05
Inventor： Young-Tak Han , Jang Uk Shin , Sang Ho Park , Yongsoon Baek
CPC classification number: H05K1/0251 , H05K1/0219 , H05K1/0221 , H05K1/141 , H05K1/142 , H05K1/144 , H05K1/145 , H05K1/181 , H05K2201/09236 , H05K2201/09618 , H05K2201/09727 , H05K2201/10121
Abstract: Provided are structures for connecting trace lines of printed circuit boards and optical transceiver modules with the same. The module may include an optical transmitter/receiver part, a signal processing unit, a flexible PCB, and a rigid PCB. The flexible PCB may include a first signal line, and the rigid PCB may include a second signal line. The flexible PCB and the rigid PCB may be overlapped with each other. The first signal line and the second signal line may not be overlapped with each other and be electrically connected to each other by a junction soldering structure. It is possible to transmit high quality and high frequency signals through the first and second signal lines.
Abstract translation: 提供了用于连接印刷电路板的轨迹线和具有该印刷电路板的光收发器模块的结构。 该模块可以包括光发射器/接收器部分，信号处理单元，柔性PCB和刚性PCB。 柔性PCB可以包括第一信号线，并且刚性PCB可以包括第二信号线。 柔性PCB和刚性PCB可以彼此重叠。 第一信号线和第二信号线可以彼此不重叠并且通过连接焊接结构彼此电连接。 可以通过第一和第二信号线传输高质量和高频信号。
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公开(公告)号：US12197002B2
公开(公告)日：2025-01-14
申请号：US17519424
申请日：2021-11-04
Inventor： Young-Tak Han , Seoktae Kim , Sang Ho Park , Yongsoon Baek , Jang Uk Shin , Seok Jun Yun , Seo Young Lee
Abstract: Disclosed are a heterogeneously integrated optical modulator and a manufacturing method thereof. The modulator includes a substrate having a trench, an input waveguide disposed at one side of the trench, an output waveguide disposed at the other side of the trench, a first Mach-Zehnder interferometer including first branch waveguides disposed between the input waveguide and the output waveguide and a heater disposed on one of the first branch waveguides, and second Mach-Zehnder interferometers connected to each of the first branch waveguides.
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