公开(公告)号：US20060041602A1

公开(公告)日：2006-02-23

申请号：US11246488

申请日：2005-10-07

Applicant: David Lomet ,  Mark Tuttle

Inventor： David Lomet ,  Mark Tuttle

IPC: G06F17/30

CPC classification number: G06F11/1471 ,  G06F2201/80 ,  G06F2201/82 ,  Y10S707/99933 ,  Y10S707/99942 ,  Y10S707/99944 ,  Y10S707/99952 ,  Y10S707/99953

Abstract: Logical logging to extend recovery is described. In one aspect, a dependency cycle between at least two objects is detected. The dependency cycle indicates that the two objects should be flushed simultaneously from a volatile main memory to a non-volatile memory to preserve those objects in the event of a system crash. One of the two objects is written to a stable of to break the dependency cycle. The other of the two objects is flushed to the non-volatile memory. The object that has been written to the stable log is then flushed to the stable log to the non-volatile memory.

公开(公告)号：US20080048835A1

公开(公告)日：2008-02-28

申请号：US11846744

申请日：2007-08-29

Applicant: James O'Toole ,  John Tuttle ,  Mark Tuttle ,  Tyler Lowrey ,  Kevin Devereaux ,  George Pax ,  Brian Higgins ,  David Ovard ,  Shu-Sun Yu ,  Robert Rotzoll

Inventor： James O'Toole ,  John Tuttle ,  Mark Tuttle ,  Tyler Lowrey ,  Kevin Devereaux ,  George Pax ,  Brian Higgins ,  David Ovard ,  Shu-Sun Yu ,  Robert Rotzoll

IPC: H04Q5/22 ,  G08B13/14

CPC classification number: G06K19/0716 ,  G06K7/0008 ,  G06K7/10059 ,  G06K19/0707 ,  G06K19/0712 ,  G06K19/0723 ,  G06K19/0726 ,  G06K19/07749 ,  G06K19/07758 ,  G06K2017/0051 ,  H01Q1/2225 ,  H03L7/0995 ,  H03L7/148

Abstract: A radio frequency identification device includes an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.

Abstract translation: 射频识别装置包括包括接收器，发射器和微处理器的集成电路。 接收机和发射机一起定义了一个有效的应答器。 集成电路优选地是包括接收器，发射器和微处理器的单片单片集成电路。 由于该设备包括有源应答器，而不是依赖于磁耦合功率的转发器，该器件具有更大的范围。

公开(公告)号：US20080048832A1

公开(公告)日：2008-02-28

申请号：US11847643

申请日：2007-08-30

Applicant: James O'Toole ,  John Tuttle ,  Mark Tuttle ,  Tyler Lowrey ,  Kevin Devereaux ,  George Pax ,  Brian Higgins ,  David Ovard ,  Shu-Sun Yu ,  Robert Rotzoll

Inventor： James O'Toole ,  John Tuttle ,  Mark Tuttle ,  Tyler Lowrey ,  Kevin Devereaux ,  George Pax ,  Brian Higgins ,  David Ovard ,  Shu-Sun Yu ,  Robert Rotzoll

IPC: H04Q5/22 ,  G08B13/14

CPC classification number: G06K19/0716 ,  G06K7/0008 ,  G06K7/10059 ,  G06K19/0707 ,  G06K19/0712 ,  G06K19/0723 ,  G06K19/0726 ,  G06K19/07749 ,  G06K19/07758 ,  H01Q1/2225 ,  H03L7/0995 ,  H03L7/148

Abstract: A radio frequency identification device includes an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.

Abstract translation: 射频识别装置包括包括接收器，发射器和微处理器的集成电路。 接收机和发射机一起定义了一个有效的应答器。 集成电路优选地是包括接收器，发射器和微处理器的单片单片集成电路。 由于该设备包括有源应答器，而不是依赖于磁耦合功率的转发器，该器件具有更大的范围。

公开(公告)号：US20080001720A1

公开(公告)日：2008-01-03

申请号：US11855037

申请日：2007-09-13

Applicant: Mark Tuttle

Inventor： Mark Tuttle

IPC: H01Q1/00

CPC classification number: G06K19/0716 ,  G06K19/0723 ,  G06K19/07345 ,  G06K19/07749 ,  H01H2231/05 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q21/28 ,  Y10T29/49004 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117

Abstract: A wireless identification device including a housing; circuitry in the housing configured to provide a signal to identify the device in response to an interrogation signal; and a selectively actuated switch supported by the housing and controlling whether the circuitry identifies the device. A method of manufacturing a wireless identification device, the method comprising configuring circuitry to provide a signal to identify the device in response to an interrogation signal; coupling the circuitry to a push-on/push-off switch supported by the housing and controlling whether the circuitry provides the signal to identify the device; and encasing the circuitry in a housing such that the switch is actuable from outside the housing by touching a portion of the housing.

Abstract translation: 一种无线识别装置，包括壳体; 外壳中的电路被配置为响应于询问信号提供信号以识别设备; 以及由壳体支撑的选择性致动的开关，并且控制电路是否识别该装置。 一种制造无线识别装置的方法，所述方法包括配置电路以响应于询问信号提供信号以识别所述装置; 将电路耦合到由壳体支持的推/推开关开关，并控制电路是否提供信号以识别装置; 并且将电路封装在壳体中，使得开关可以通过触摸壳体的一部分从壳体外部致动。

公开(公告)号：US20070075837A1

公开(公告)日：2007-04-05

申请号：US11607251

申请日：2006-12-01

Applicant: Mark Tuttle ,  John Tuttle

Inventor： Mark Tuttle ,  John Tuttle

IPC: H04Q5/22

CPC classification number: H01Q1/2225 ,  G01S13/767 ,  G01S13/78 ,  G06K7/10346 ,  G06K19/0723 ,  G06K19/0726 ,  G06K19/07749 ,  H01Q1/22 ,  H01Q7/00

Abstract: An adjustable radio frequency data communications device has a monolithic semiconductor integrated circuit with integrated circuitry, interrogation receiving circuitry provided on the monolithic integrated circuit forming at least part of the integrated circuitry and configured to receive an interrogation signal from the interrogator unit, an antenna electrically coupled to the interrogation receiving circuitry and configured to communicate with the remote interrogator unit, a power source electrically coupled to the integrated circuitry and configured to generate operating power for the communications device, and at least one of the antenna and the interrogation receiving circuitry having reconfigurable electrical characteristics, the electrical characteristics being reconfigurable to selectively tune the at least one of the antenna and the interrogation receiving circuitry within a range of tuned and detuned states to realize a desired receiver sensitivity of the communications device. Additionally, a method for tuning receiver sensitivity and/or transmitter sensitivity according to construction of the above device is disclosed.

公开(公告)号：US20060136284A1

公开(公告)日：2006-06-22

申请号：US11015276

申请日：2004-12-17

Applicant: Baruch Awerbuch ,  Boaz Patt-shamir ,  David Peleg ,  Mark Tuttle

Inventor： Baruch Awerbuch ,  Boaz Patt-shamir ,  David Peleg ,  Mark Tuttle

IPC: G07G1/00

CPC classification number: G06Q30/02 ,  G06Q30/0278

Abstract: A technique for recommending products to a user (110a). According to the technique, the user requests (110a) a recommendation from a recommendation system (200). The recommendation system (200) generates a recommendation using a technique whose time complexity is less than O(m·n). The generated list is then presented to the user (110a).

Abstract translation: 一种用于向用户推荐产品的技术（110a）。 根据该技术，用户从推荐系统（200）请求（110a）推荐。 推荐系统（200）使用时间复杂度小于O（m.n）的技术生成推荐。 然后将生成的列表呈现给用户（110a）。

公开(公告)号：US06717241B1

公开(公告)日：2004-04-06

申请号：US09653541

申请日：2000-08-31

Applicant: Mark Tuttle

Inventor： Mark Tuttle

IPC: H01L23552

CPC classification number: H05K1/0233 ,  H01L23/552 ,  H01L23/585 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/3025 ,  H01L2224/0401

Abstract: A method and apparatus which provide one or more electromagnetic shield layers for integrated circuit chips containing electromagnetic circuit elements are disclosed. The shield layers may be in contact with the integrated circuit chip, including magnetic memory structures such as MRAMs, or in a flip-chip carrier, or both. A printed circuit board which supports the chip may also have one or more shield layers.

Abstract translation: 公开了一种为包含电磁电路元件的集成电路芯片提供一个或多个电磁屏蔽层的方法和装置。 屏蔽层可以与集成电路芯片接触，包括诸如MRAM的磁存储器结构，或者在倒装芯片载体中，或者两者。 支撑芯片的印刷电路板也可以具有一个或多个屏蔽层。

公开(公告)号：US20110233777A1

公开(公告)日：2011-09-29

申请号：US13154550

申请日：2011-06-07

Applicant: Salman Akram ,  Charles Watkins ,  Mark Hiatt ,  David Hembree ,  James Wark ,  Warren Farnworth ,  Mark Tuttle ,  Sidney Rigg ,  Steven Oliver ,  Kyle Kirby ,  Alan Wood ,  Lu Velicky

Inventor： Salman Akram ,  Charles Watkins ,  Mark Hiatt ,  David Hembree ,  James Wark ,  Warren Farnworth ,  Mark Tuttle ,  Sidney Rigg ,  Steven Oliver ,  Kyle Kirby ,  Alan Wood ,  Lu Velicky

IPC: H01L23/498 ,  H01L23/48

CPC classification number: H01L21/76877 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/45 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2221/6834 ,  H01L2224/02166 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

Abstract translation: 公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。 此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。

公开(公告)号：US07342409B2

公开(公告)日：2008-03-11

申请号：US11516342

申请日：2006-09-06

Applicant: Warren M. Farnworth ,  Mark Tuttle

Inventor： Warren M. Farnworth ,  Mark Tuttle

IPC: G01R31/26

CPC classification number: G01R31/2886

Abstract: A system for testing semiconductor components includes an interconnect, an alignment system for aligning a substrate to the interconnect, a bonding system for bonding the component to the interconnect, and a heating system for heating the component and the interconnect for separation. The interconnect includes interconnect contacts configured for bonding to, and then separation from component contacts on the components. The system can be utilized with a method that includes the steps of bonding the interconnect to the component to form bonded electrical connections, applying test signals through the bonded electrical connections, and then separating the interconnect from the component. The bonding step can be performed using metallurgical bonding, and the separating step can be performed using solder-wettable and solder non-wettable metal layers on the interconnect or the component. During the separating step the solder-wettable layers are dissolved, reducing adhesion of the bonded electrical connections, and permitting separation of the component and interconnect.

Abstract translation: 用于测试半导体部件的系统包括互连，用于将衬底对准互连的对准系统，用于将部件接合到互连的接合系统，以及用于加热组件和用于分离的互连的加热系统。 互连包括被配置用于结合到组件上并且然后与组件上的组件触点分离的互连触点。 该系统可以利用包括以下步骤的方法：将互连件连接到部件以形成结合的电连接，通过结合的电连接施加测试信号，然后将互连件与部件分离。 接合步骤可以使用冶金结合进行，并且分离步骤可以使用在互连或部件上的可焊接润湿和焊接不可润湿的金属层进行。 在分离步骤期间，可焊接润湿层被溶解，减少了粘合的电连接的粘合性，并允许部件和互连的分离。

公开(公告)号：US07259581B2

公开(公告)日：2007-08-21

申请号：US11057500

申请日：2005-02-14

Applicant: Warren M. Farnworth ,  Mark Tuttle

Inventor： Warren M. Farnworth ,  Mark Tuttle

IPC: G01R31/26

CPC classification number: G01R31/2886

Abstract: A method for testing a semiconductor component includes the steps of bonding an interconnect to the component to form bonded electrical connections, applying test signals through the bonded electrical connections, and then separating the interconnect from the component. The bonding step can be performed using metallurgical bonding, and the separating step can be performed using solder-wettable and solder non-wettable metal layers on the interconnect or the component. During the separating step the solder-wettable layers are dissolved, reducing adhesion of the bonded electrical connections, and permitting separation of the component and interconnect. The interconnect includes interconnect contacts configured for bonding to, and then separation from component contacts on the components. A system includes the interconnect, an alignment system for aligning the substrate to the interconnect, a bonding system for bonding the component to the interconnect, and a heating system for heating the component and the interconnect for separation.

Abstract translation: 用于测试半导体部件的方法包括以下步骤：将互连件连接到部件以形成结合的电连接，通过结合的电连接施加测试信号，然后将该互连件与部件分离。 接合步骤可以使用冶金结合进行，并且分离步骤可以使用在互连或部件上的可焊接润湿和焊接不可润湿的金属层进行。 在分离步骤期间，可焊接润湿层被溶解，减少了粘合的电连接的粘合性，并允许部件和互连的分离。 互连包括被配置用于结合到组件上并且然后与组件上的组件触点分离的互连触点。 系统包括互连，用于将衬底对准互连的对准系统，用于将组件粘合到互连的接合系统，以及用于加热组件和用于分离的互连的加热系统。