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    ALIGNING OPTICAL COMPONENTS IN A MULTICHANNEL RECEIVER OR TRANSMITTER PLATFORM
    2.
    发明申请
    ALIGNING OPTICAL COMPONENTS IN A MULTICHANNEL RECEIVER OR TRANSMITTER PLATFORM 有权
    在多通道接收机或发射机平台中对准光学部件

    公开(公告)号：US20160050019A1

    公开(公告)日：2016-02-18

    申请号：US14462239

    申请日：2014-08-18

    Applicant: Cisco Technology, Inc.

    Inventor： Prakash GOTHOSKAR ,  Vipulkumar PATEL ,  Kalpendu SHASTRI ,  Rao V. YELAMARTY

    IPC: H04B10/40

    CPC classification number: H04B10/40 ,  G02B6/4215 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4249

    Abstract: Embodiments described herein describe a sub-mount that is etched to include respective cavities with at least two adjacent sides that align optical filters and a mirror. Moreover, the cavities are arranged on the sub-mount such that when the filters and mirror are disposed in the cavities, they align in a manner that enables the performance of a multiplexing or demultiplexing function as part of, for example, a zigzag multiplexer/demultiplexer. In one embodiment, the filters and mirrors are aligned passively rather than actively. The sub-mount may then be placed on a substrate that includes other components of a ROSA or TOSA. In one embodiment, the substrate is also etched to include a cavity two adjacent sides to align the sub-mount so that sub-mount is passively aligned once disposed into the cavity.

    Abstract translation: 本文所述的实施例描述了一种子座，其被蚀刻以包括具有对准光学滤光器和反射镜的至少两个相邻侧的相应空腔。 此外，空腔被布置在子安装座上，使得当滤光器和反射镜设置在空腔中时，它们以使得能够执行复用或解复用功能作为例如锯齿形复用器/ 解复用器 在一个实施例中，滤波器和反射镜被动地而不是主动对准。 然后可以将该子安装件放置在包括ROSA或TOSA的其它部件的基板上。 在一个实施例中，衬底也被蚀刻以包括两个相邻侧面的空腔以对准子安装座，使得一旦设置在空腔中，子安装座被动地对准。

    WAFER SCALE PACKAGING PLATFORM FOR TRANSCEIVERS
    4.
    发明申请
    WAFER SCALE PACKAGING PLATFORM FOR TRANSCEIVERS 有权
    收货机的平均包装平台

    公开(公告)号：US20140248723A1

    公开(公告)日：2014-09-04

    申请号：US14276566

    申请日：2014-05-13

    Applicant: Cisco Technology, Inc.

    Inventor： Kalpendu SHASTRI ,  Vipulkumar PATEL ,  Mark WEBSTER ,  Prakash GOTHOSKAR ,  Ravinder KACHRU ,  Soham PATHAK ,  Rao V. YELAMARTY ,  Thomas DAUGHERTY ,  Bipin DAMA ,  Kaushik PATEL ,  Kishor DESAI

    IPC: H01L25/00 ,  H01L25/16

    CPC classification number: H01L25/50 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4257 ,  G02B6/426 ,  H01L25/167 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

    Abstract: A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.

    Abstract translation: 光电子收发器组件过程的晶片级实现利用硅晶片作为光学参考平面和平台，同时为多个单独的收发器模块组装所有必需的光学和电子部件。 特别地，硅晶片被用作“平台”（插入器），在其上安装或集成多个收发器模块的所有组件，硅插入器的顶表面用作参考平面，用于定义 分离光学元件之间的光信号路径。 实际上，通过使用单个硅晶片作为大量单独的收发器模块的平台，可以使用晶片尺度组装过程以及这些模块的光学对准和测试。

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