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1.发明授权公开(公告)号：US10450648B2
公开(公告)日：2019-10-22
申请号：US16197466
申请日：2018-11-21
Applicant: CORNING INCORPORATED
IPC: H02N13/00 , C23C14/50 , C23C14/24 , C03C17/00 , C03C23/00 , C03C27/06 , H01L21/67 , H01L21/683 , H01L21/687
Abstract: A chucking apparatus and methods for coating a glass substrate using a vacuum deposition process are disclosed. In one or more embodiments, the chucking apparatus includes an ESC (ESC), a carrier disposed on the ESC, wherein the carrier comprises a first surface adjacent to the ESC and an opposing second surface for forming a Van der Waals bond with a third surface of a glass substrate, without application of a mechanical force on a fourth surface of the glass substrate opposing the third surface. In one or more embodiments, the method includes disposing a carrier and a glass substrate on an ESC, such that the carrier is between the glass substrate and the ESC to form a chucking assembly, forming a Van der Waals bond between the carrier and the glass substrate, and vacuum depositing a coating on the glass substrate.
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公开(公告)号：US20180053677A1
公开(公告)日：2018-02-22
申请号：US15553676
申请日：2016-02-23
Applicant: CORNING INCORPORATED
Inventor： Daniel Robert Boughton , James Gerard Fagan , Valerie Elise Mebert
IPC: H01L21/683 , H01L21/68 , H01L21/02
Abstract: An electrostatic chucking apparatus includes a movable member arranged for movement relative to an axial axis, at least one electrostatic chuck coupled to the movable member, and a stationary member. At least one moving insulated electrode is coupled to the movable member, and at least one stationary insulated electrode is coupled to the stationary member in an axial position corresponding to the at least one moving insulated electrode. A slip ring contact couples electrical energy from the at least one stationary insulated electrode to the at least one moving insulated electrode.
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公开(公告)号：US20190271344A1
公开(公告)日：2019-09-05
申请号：US16343884
申请日：2017-10-20
Applicant: CORNING INCORPORATED
Inventor： Daniel Robert Boughton , James Gerard Fagan , Thomas Augustus Keebler
Abstract: A carrier apparatus including a base including an outer peripheral surface and an inner support surface, a frame to connect to the outer peripheral surface of the base, and a circumferential flange including an outer circumferential portion and an inner circumferential portion. The outer circumferential portion to be clamped between the frame and the outer peripheral surface of the base, and the inner circumferential portion to extend inward from the frame. The inner circumferential portion including an opening to be spaced a distance from the inner support surface of the base. The carrier apparatus may include an article including a first major surface, a second major surface, a thickness between the first major surface and the second major surface, and an edge extending across the thickness between the first major surface and the second major surface. Methods of processing and assembling the carrier apparatus may also be provided.
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公开(公告)号：US20190153588A1
公开(公告)日：2019-05-23
申请号：US16300228
申请日：2017-05-12
Applicant: CORNING INCORPORATED
Inventor： Daniel Robert Boughton , James Gerard Fagan , Thomas Augustus Keebler
IPC: C23C14/50 , B23Q3/15 , B65G47/92 , C23C16/458 , H01J37/32 , H01L21/683 , H01L21/687
Abstract: An electrostatic chuck apparatus for chucking glass includes a substantially rigid chassis with a plurality of apertures extending from one side of the chassis to another side of the chassis. A plurality of electrostatic chuck pins extend through the openings and are resiliently mounted to the chassis such that the extent to which the electrostatic chuck pins extend through the chassis is individually variable. With this construction, the electrostatic chuck pins maintaining contact with the surface of the glass despite the presence of some variation in the localized surface flatness of the glass.
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公开(公告)号：US20180002217A1
公开(公告)日：2018-01-04
申请号：US15631808
申请日：2017-06-23
Applicant: Corning Incorporated
Inventor： Daniel Robert Boughton , James Gerard Fagan , Larry Gleason Hubbard, JR. , Ji Wang
IPC: C03B37/014
CPC classification number: C03B37/014 , C03B37/01217 , C03B37/01222 , C03B37/01282 , C03B37/0142 , C03B2201/06 , C03B2201/10 , C03B2203/14 , C03B2203/30 , C03B2203/31 , C03B2203/34
Abstract: According to some embodiments method for making an optical fiber preform comprises the steps of: (i) placing a plurality of rods with an outer surface having a coefficient of friction 0.02≦COF≦0.3 into an inner cavity of an apparatus; (ii) placing particulate glass material in the inner cavity between the rods and an inner wall of the mold cavity; and (iii) applying pressure against the particulate glass material to press the particulate glass material against the plurality of rods.
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Patent Agency Ranking
公开(公告)号：US20140294717A1
公开(公告)日：2014-10-02
申请号：US13851441
申请日：2013-03-27
Applicant: CORNING INCORPORATED
Inventor： James Gerard Fagan
IPC: C01B31/12
CPC classification number: C01B31/12 , C01B32/342 , C01B32/382
Abstract: The disclosure relates to methods for forming activated carbon comprising providing a feedstock mixture comprising a carbon feedstock and at least one chemical activating agent, heating the feedstock mixture to at least the fluxing temperature of the feedstock mixture to form a feedstock melt, atomizing the feedstock melt and introducing the atomized feedstock mixture into a reactor, rapidly heating the atomized feedstock to at least the solidification temperature by introducing a hot stream into the reactor, introducing the heated feedstock mixture into a reaction vessel, and holding the heated feedstock mixture in the reaction vessel at a temperature and for a time sufficient to react the carbon feedstock with the at least one chemical activating agent to form activated carbon, wherein rapidly heating the atomized feedstock comprises heating the mixture within a time period sufficient to maintain the feedstock mixture in a substantially solid state throughout the rapid heating stage.
Abstract translation: 本公开涉及用于形成活性炭的方法，包括提供包含碳原料和至少一种化学活化剂的原料混合物，将原料混合物加热至至少原料混合物的助熔温度以形成原料熔体，将原料熔体雾化 并将雾化的原料混合物引入反应器中，通过将热流引入反应器，将加热的原料混合物引入反应容器，并将加热的原料混合物保持在反应容器中，将雾化的原料快速加热至至少凝固温度 在足以使碳原料与至少一种化学活化剂反应形成活性炭的温度和时间下，其中快速加热雾化原料包括在足以将原料混合物保持在基本上固体的时间内加热该混合物 状态在整个快速加热阶段。
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公开(公告)号：US10546768B2
公开(公告)日：2020-01-28
申请号：US15553676
申请日：2016-02-23
Applicant: CORNING INCORPORATED
Inventor： Daniel Robert Boughton , James Gerard Fagan , Valerie Elise Mebert
IPC: H01L21/683 , H01L21/68 , H01L21/02
Abstract: An electrostatic chucking apparatus includes a movable member arranged for movement relative to an axial axis, at least one electrostatic chuck coupled to the movable member, and a stationary member. At least one moving insulated electrode is coupled to the movable member, and at least one stationary insulated electrode is coupled to the stationary member in an axial position corresponding to the at least one moving insulated electrode. A slip ring contact couples electrical energy from the at least one stationary insulated electrode to the at least one moving insulated electrode.
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8.发明申请公开(公告)号：US20190270669A1
公开(公告)日：2019-09-05
申请号：US16344982
申请日：2017-10-24
Applicant: CORNING INCORPORATED
Inventor： Daniel Robert Boughton , James Gerard Fagan , Valerie Elise Mebert , Kenneth Spencer Morgan
Abstract: A method of preparing a glass, glass-ceramic or ceramic substrate for coating that includes: treating a primary surface of a carrier to form a carrier bonding surface, the carrier having a thickness of at least 2 mm; disposing a carrier surface modification layer on the carrier bonding surface; bonding the carrier to at least one substrate having a substrate bonding surface and a thickness from about 0.1 mm to about 3.5 mm, the bonding conducted by temporarily joining the carrier at the carrier surface modification layer to the substrate at the substrate bonding surface. Further, the treating and disposing steps are conducted such that an adhesion energy between the carrier surface modification layer and the substrate bonding surface is from 50 to 1000 mJ/m2 after the bonding step.
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9.发明申请公开(公告)号：US20190085443A1
公开(公告)日：2019-03-21
申请号：US16197466
申请日：2018-11-21
Applicant: CORNING INCORPORATED
IPC: C23C14/50 , C23C14/24 , H02N13/00 , C03C17/00 , C03C23/00 , C03C27/06 , H01L21/67 , H01L21/683 , H01L21/687
CPC classification number: C23C14/50 , C03C17/002 , C03C23/0075 , C03C27/06 , C03C2218/30 , C23C14/24 , H01L21/6715 , H01L21/6831 , H01L21/68785 , H02N13/00
Abstract: A chucking apparatus and methods for coating a glass substrate using a vacuum deposition process are disclosed. In one or more embodiments, the chucking apparatus includes an ESC (ESC), a carrier disposed on the ESC, wherein the carrier comprises a first surface adjacent to the ESC and an opposing second surface for forming a Van der Waals bond with a third surface of a glass substrate, without application of a mechanical force on a fourth surface of the glass substrate opposing the third surface. In one or more embodiments, the method includes disposing a carrier and a glass substrate on an ESC, such that the carrier is between the glass substrate and the ESC to form a chucking assembly, forming a Van der Waals bond between the carrier and the glass substrate, and vacuum depositing a coating on the glass substrate.
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公开(公告)号：US20180108560A1
公开(公告)日：2018-04-19
申请号：US15568875
申请日：2016-04-22
Applicant: CORNING INCORPORATED
Inventor： Daniel Robert Boughton , James Gerard Fagan , Valerie Elise Mebert , Kenneth Spencer Morgan
IPC: H01L21/687
CPC classification number: H01L21/68728 , C23C14/50 , H01L21/68735
Abstract: Substrate holders having support plates for mounting of substrates are disclosed. The substrate holders use a combination of spring clamping elements and pins to grip the substrates. The substrate edge contact height of the spring clamping elements and pins may be selected such that upper portions of the side edges of the substrates are substantially unobstructed, allowing coating to be applied to upper surfaces and upper portions of the side edges of the substrates contemporaneously.
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