公开(公告)号：US20180053677A1

公开(公告)日：2018-02-22

申请号：US15553676

申请日：2016-02-23

Applicant: CORNING INCORPORATED

Inventor： Daniel Robert Boughton ,  James Gerard Fagan ,  Valerie Elise Mebert

IPC: H01L21/683 ,  H01L21/68 ,  H01L21/02

Abstract: An electrostatic chucking apparatus includes a movable member arranged for movement relative to an axial axis, at least one electrostatic chuck coupled to the movable member, and a stationary member. At least one moving insulated electrode is coupled to the movable member, and at least one stationary insulated electrode is coupled to the stationary member in an axial position corresponding to the at least one moving insulated electrode. A slip ring contact couples electrical energy from the at least one stationary insulated electrode to the at least one moving insulated electrode.

公开(公告)号：US10546768B2

公开(公告)日：2020-01-28

申请号：US15553676

申请日：2016-02-23

Applicant: CORNING INCORPORATED

Inventor： Daniel Robert Boughton ,  James Gerard Fagan ,  Valerie Elise Mebert

IPC: H01L21/683 ,  H01L21/68 ,  H01L21/02

Abstract: An electrostatic chucking apparatus includes a movable member arranged for movement relative to an axial axis, at least one electrostatic chuck coupled to the movable member, and a stationary member. At least one moving insulated electrode is coupled to the movable member, and at least one stationary insulated electrode is coupled to the stationary member in an axial position corresponding to the at least one moving insulated electrode. A slip ring contact couples electrical energy from the at least one stationary insulated electrode to the at least one moving insulated electrode.

公开(公告)号：US20190270669A1

公开(公告)日：2019-09-05

申请号：US16344982

申请日：2017-10-24

Applicant: CORNING INCORPORATED

Inventor： Daniel Robert Boughton ,  James Gerard Fagan ,  Valerie Elise Mebert ,  Kenneth Spencer Morgan

IPC: C03C17/00 ,  C04B41/87 ,  C04B41/89

Abstract: A method of preparing a glass, glass-ceramic or ceramic substrate for coating that includes: treating a primary surface of a carrier to form a carrier bonding surface, the carrier having a thickness of at least 2 mm; disposing a carrier surface modification layer on the carrier bonding surface; bonding the carrier to at least one substrate having a substrate bonding surface and a thickness from about 0.1 mm to about 3.5 mm, the bonding conducted by temporarily joining the carrier at the carrier surface modification layer to the substrate at the substrate bonding surface. Further, the treating and disposing steps are conducted such that an adhesion energy between the carrier surface modification layer and the substrate bonding surface is from 50 to 1000 mJ/m2 after the bonding step.

公开(公告)号：US20180108560A1

公开(公告)日：2018-04-19

申请号：US15568875

申请日：2016-04-22

Applicant: CORNING INCORPORATED

Inventor： Daniel Robert Boughton ,  James Gerard Fagan ,  Valerie Elise Mebert ,  Kenneth Spencer Morgan

IPC: H01L21/687

CPC classification number: H01L21/68728 ,  C23C14/50 ,  H01L21/68735

Abstract: Substrate holders having support plates for mounting of substrates are disclosed. The substrate holders use a combination of spring clamping elements and pins to grip the substrates. The substrate edge contact height of the spring clamping elements and pins may be selected such that upper portions of the side edges of the substrates are substantially unobstructed, allowing coating to be applied to upper surfaces and upper portions of the side edges of the substrates contemporaneously.