公开(公告)号：US20250040095A1

公开(公告)日：2025-01-30

申请号：US18660542

申请日：2024-05-10

Applicant: CHROMA ATE INC.

Inventor： Xin-Yi Wu ,  Yu-Wei Chuang ,  I-Ching Tsai

IPC: H05K7/20 ,  G01R1/04

Abstract: A phase-change temperature regulating system and an electronic device testing apparatus and method are described. In an embodiment, the system uses a temperature regulating fluid chamber containing a temperature regulating fluid to allow the temperature regulating fluid to cover at least a part of at least one surface of an electronic component. When a temperature of the electronic component reaches a boiling point of the temperature regulating fluid, the temperature regulating fluid becomes steam through a phase change to transfer heat energy outward from the electronic component, and condenses on an inner surface of the fluid chamber to further transfer heat energy of the steam to a temperature-regulating apparatus. The condensed temperature regulating fluid flows back to the temperature regulating fluid, thereby continuously circulating.

公开(公告)号：US12253541B2

公开(公告)日：2025-03-18

申请号：US18050500

申请日：2022-10-28

Applicant: CHROMA ATE INC.

Inventor： I-Shih Tseng ,  Xin-Yi Wu ,  I-Ching Tsai ,  Chin-Yi Ouyang

IPC: G01R1/04 ,  G01R31/28

Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system mainly comprises a coolant circulation module, which includes a coolant supply channel communicated with an inlet of a chip socket and a coolant recovery channel communicated with an outlet of the chip socket. When an electronic device is accommodated in the chip socket, the coolant circulation module supplies a coolant into the chip socket through the coolant supply channel and the inlet, and the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet.

公开(公告)号：US20250027987A1

公开(公告)日：2025-01-23

申请号：US18662134

申请日：2024-05-13

Applicant: CHROMA ATE INC.

Inventor： I-Shih Tseng ,  Chin-Yi Ou Yang ,  I-Ching Tsai ,  Xin-Yi Wu

IPC: G01R31/28 ,  G01R1/04

Abstract: An inspection system with a thermal interface, and an electronic component inspection device and method are provided. First, a temperature regulator contacts an electronic component to be tested, where there is a thermal interface between the temperature regulator and the electronic component to be tested, and the electronic component to be tested includes a plurality of temperature sensing units. Then, the temperature regulator heats or cools the electronic component to be tested to a specific temperature, and the plurality of temperature sensing units of the electronic component to be tested detect temperatures at locations of the temperature sensing units. In this way, a contact condition between the temperature regulator and the electronic component to be tested, and quality or an aging status of the thermal interface can be determined.