GRINDING TABLE APPARATUS, LIQUID CRYSTAL DISPLAY GLASS GRINDER AND GRINDING METHOD

    公开(公告)号:US20170113318A1

    公开(公告)日:2017-04-27

    申请号:US15231968

    申请日:2016-08-09

    CPC classification number: B24B9/08 B24B41/068 G02F1/1303

    Abstract: A grinding table apparatus, liquid crystal display glass grinder and grinding method are disclosed, the apparatus including, a liftable central platform, a liftable outer-ring platform provided with a hollow slot, and a peripheral platform, the central platform being in the hollow slot of the outer-ring platform, and at one side of the peripheral platform together with the outer-ring platform, when the central platform is lifted to be coplanar with the peripheral platform, fixedly installing a first panel on the central platform, moving the peripheral platform to make an edge of the first panel exposed out, when the central platform and the outer-ring platform are both lifted to be coplanar with the peripheral platform, fixedly installing a second panel on the central platform and the outer-ring platform, moving the peripheral platform to make an edge of the second panel exposed out, the first panel being smaller than the second panel.

    WIRING SUBSTRATE AND MANUFACTURING METHOD THEREFOR, LIGHT-EMITTING PANEL, AND DISPLAY DEVICE

    公开(公告)号:US20240413290A1

    公开(公告)日:2024-12-12

    申请号:US18700693

    申请日:2023-05-15

    Abstract: A wiring substrate, a manufacturing method thereof, a light-emitting panel, and a display device are disclosed. The wiring substrate includes: a base substrate (11); and a plurality of metal traces (50) and an organic insulating layer (13), which are located at one side of the base substrate. The metal traces (50) each comprise a first metal layer (141) and a second metal layer (151), which are stacked; the first metal layer (141) is located between the second metal layer (151) and the base substrate (11); an angle between a side wall of the second metal layer (151) and the base substrate (11) is greater than or equal to 90°; the area of a contact face between each of the metal traces (50) and the base substrate (11) is greater than or equal to the area of the surface of the second metal layer (151) opposite the first metal layer (141).

    TOUCH SUBSTRATE AND TOUCH DEVICE
    5.
    发明申请

    公开(公告)号:US20220397998A1

    公开(公告)日:2022-12-15

    申请号:US17771916

    申请日:2021-07-12

    Abstract: A touch substrate includes: a substrate, which includes a touch area and a bonding area on one side of the touch area; and a plurality of pads on the substrate, wherein the plurality of pads are arranged in the bonding area at intervals, wherein the pad includes a first metal layer, a first organic layer and a second metal layer, arranged in this order on the substrate, a first via is formed in the first metal layer, a second via is formed in the first organic layer, an orthographic projection of the first via on the substrate and an orthographic projection of the second via on the substrate do not overlap, a part of the first organic layer is in the first via, and a part of the second metal layer is in contact with the first metal layer through the second via.

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