公开(公告)号：US20190157052A1

公开(公告)日：2019-05-23

申请号：US15821661

申请日：2017-11-22

Applicant: APPLIED MATERIALS, INC.

Inventor： Kenny Linh DOAN ,  Usama Dadu ,  Wonseok Lee ,  Daishuke Shimizu ,  Li Ling ,  Kevin Choi

IPC: H01J37/32 ,  H02N13/00 ,  H01L21/683 ,  B08B5/00 ,  B08B7/00

CPC classification number: H01J37/32862 ,  B08B5/00 ,  B08B7/0071 ,  H01J37/32146 ,  H01J37/32724 ,  H01J37/32816 ,  H01L21/67069 ,  H01L21/6831 ,  H02N13/00

Abstract: Embodiments include a plasma processing method for cleaning polymer byproducts from interior surfaces of the plasma chamber. In an embodiment the plasma process may include processing a workpiece in a plasma processing chamber. Thereafter, the method may include removing the workpiece from the processing chamber. After the workpiece is removed, embodiments may include cleaning the plasma processing chamber with a cleaning process that includes a high pressure cleaning process, a first low pressure cleaning process, and a second low pressure cleaning process, wherein the second low pressure cleaning process includes applying a pulsed bias.

公开(公告)号：US20150001180A1

公开(公告)日：2015-01-01

申请号：US14020774

申请日：2013-09-06

Applicant: Applied Materials, Inc.

Inventor： Kenny Linh DOAN ,  Jason Della ROSA ,  Hamid NOORBAKHSH ,  Jong Mun KIM

IPC: H01J37/32 ,  B32B18/00

CPC classification number: H01J37/32642 ,  H01J37/32449 ,  H01J37/32623 ,  H01J37/32651

Abstract: A tunable ring assembly, a plasma processing chamber having a tunable ring assembly and method for tuning a plasma process is provided. In one embodiment, a tunable ring assembly includes an outer ceramic ring having an exposed top surface and a bottom surface and an inner silicon ring configured to mate with the outer ceramic ring to define an overlap region, the inner silicon ring having an inner surface, a top surface and a notch formed between the inner surface and the top surface, the inner surface defining an inner diameter of the ring assembly, the notch is sized to accept an edge of a substrate, an outer portion of the top surface of the inner silicon ring configured to contact in the overlap region and underlying an inner portion of the bottom surface of the outer ceramic ring.

Abstract translation: 提供了一种可调环组件，具有可调环组件的等离子体处理室和用于调谐等离子体工艺的方法。 在一个实施例中，可调谐环组件包括具有暴露的顶表面和底表面的外陶瓷环和被配置为与外陶瓷环配合以限定重叠区域的内硅环，内硅环具有内表面， 在所述内表面和所述顶表面之间形成的顶表面和凹口，所述内表面限定所述环组件的内径，所述凹口的尺寸设置成接受基底的边缘，所述内表面的顶表面的外部 硅环构造成在重叠区域中接触并且位于外陶瓷环的底表面的内部下方。