公开(公告)号：US20190157052A1

公开(公告)日：2019-05-23

申请号：US15821661

申请日：2017-11-22

Applicant: APPLIED MATERIALS, INC.

Inventor： Kenny Linh DOAN ,  Usama Dadu ,  Wonseok Lee ,  Daishuke Shimizu ,  Li Ling ,  Kevin Choi

IPC: H01J37/32 ,  H02N13/00 ,  H01L21/683 ,  B08B5/00 ,  B08B7/00

CPC classification number: H01J37/32862 ,  B08B5/00 ,  B08B7/0071 ,  H01J37/32146 ,  H01J37/32724 ,  H01J37/32816 ,  H01L21/67069 ,  H01L21/6831 ,  H02N13/00

Abstract: Embodiments include a plasma processing method for cleaning polymer byproducts from interior surfaces of the plasma chamber. In an embodiment the plasma process may include processing a workpiece in a plasma processing chamber. Thereafter, the method may include removing the workpiece from the processing chamber. After the workpiece is removed, embodiments may include cleaning the plasma processing chamber with a cleaning process that includes a high pressure cleaning process, a first low pressure cleaning process, and a second low pressure cleaning process, wherein the second low pressure cleaning process includes applying a pulsed bias.