公开(公告)号：US20240258070A1

公开(公告)日：2024-08-01

申请号：US18104108

申请日：2023-01-31

Applicant: Applied Materials, Inc.

Inventor： Michael Andrew STEARNS ,  Kartik RAMASWAMY ,  Carlaton WONG

IPC: H01J37/32

CPC classification number: H01J37/3211 ,  H01J37/32174 ,  H01J2237/3344

Abstract: Embodiments of the present disclosure include an apparatus and methods for the plasma processing of a substrate. Some embodiments are directed to a plasma processing chamber. The plasma processing chamber generally includes a planar coil region comprising a plurality of planar coils, a first power supply circuit coupled to at least two of the plurality of planar coils, a concentric coil region at least partially surrounding the planar coil region, and a second power supply circuit coupled to at least two of a plurality of concentric coils. The first power supply circuit may be configured to bias the at least two of the plurality of planar coils to affect a plasma in a center region of the plasma processing chamber, and the second power supply circuit may be configured to bias the at least two of the plurality of concentric coils to affect the plasma in an outer region.

公开(公告)号：US20220102117A1

公开(公告)日：2022-03-31

申请号：US17032220

申请日：2020-09-25

Applicant: APPLIED MATERIALS, INC.

Inventor： Reyn Tetsuro WAKABAYASHI ,  Carlaton WONG ,  Timothy Joseph FRANKLIN

IPC: H01J37/32 ,  H01L21/67

Abstract: Embodiments of components for use in substrate process chambers are provided herein. In some embodiments, a component for use in a substrate process chamber includes: a body having an opening extending partially through the body from a top surface of the body, wherein the opening includes a threaded portion for fastening the body to a second process chamber component, wherein the threaded portion includes a plurality of threads defining a plurality of rounded crests and a plurality of rounded roots, and wherein a depth of the threaded portion, being a radial distance between a rounded crest of the plurality of rounded crests and an adjacent root of the plurality of rounded roots, decreases from a first depth to a second depth at a last thread of the plurality of threads.

公开(公告)号：US20210391146A1

公开(公告)日：2021-12-16

申请号：US16899326

申请日：2020-06-11

Applicant: APPLIED MATERIALS, INC.

Inventor： Timothy Joseph FRANKLIN ,  Rajinder DHINDSA ,  Daniel Sang BYUN ,  Carlaton WONG ,  Joseph PERRY ,  James Hugh ROGERS

IPC: H01J37/32 ,  H01L21/67

Abstract: Methods and apparatus for processing a substrate are provided herein. In some embodiments, a method of processing a substrate in an etch process chamber includes: pulsing RF power from an RF bias power supply to a lower electrode disposed in a substrate support of the etch process chamber at a first frequency of about 200 kHz to about 700 kHz over a first period to create a plasma in a process volume of the etch process chamber, wherein a conductance liner surrounds the process volume to provide a ground path for an upper electrode of the etch process chamber; and pulsing RF power from the RF bias power supply to the lower electrode at a second frequency of about 2 MHz to about 13.56 MHz over the first period.

公开(公告)号：US20210287881A1

公开(公告)日：2021-09-16

申请号：US17156957

申请日：2021-01-25

Applicant: APPLIED MATERIALS, INC.

Inventor： Timothy Joseph FRANKLIN ,  Carlaton WONG ,  Reyn Tetsuro WAKABAYASHI ,  Daniel Sang BYUN ,  Steven BABAYAN

IPC: H01J37/32 ,  H01L21/687

Abstract: An apparatus for processing substrates that includes a process chamber with a process volume located above a substrate support assembly surrounded by an edge ring, an upper electrode located above the process volume and a conductive tuning ring surrounding the upper electrode and in electrical contact with the upper electrode. The conductive tuning ring has at least one gas port on a lower surface above the edge ring. The conductive tuning may also have at least one stepped portion on the lower surface that forms an extended bottom surface. In some embodiments, the extended bottom surface may slant radially inwardly or radially outwardly. In some embodiments, the extended bottom surface may have one or more radiused edges.

公开(公告)号：US20220093362A1

公开(公告)日：2022-03-24

申请号：US17370619

申请日：2021-07-08

Applicant: Applied Materials, Inc.

Inventor： Joseph Frederick BEHNKE ,  Reyn Tetsuro WAKABAYASHI ,  Carlaton WONG ,  Timothy Joseph FRANKLIN ,  Joseph F. SOMMERS

IPC: H01J37/32

Abstract: Embodiments of showerheads are provided herein. In some embodiments, a showerhead assembly includes a chill plate comprising a gas plate and a cooling plate having an aluminum-silicon foil interlayer disposed therebetween for diffusion bonding the gas plate to the cooling plate and a heater plate comprising a first plate, a second plate, and a third plate, wherein an aluminum-silicon foil interlayer is disposed between the first plate and the cooling plate for diffusion bonding the first plate to the cooling plate, wherein an aluminum-silicon foil interlayer is disposed between the first plate and the second plate for diffusion bonding the first plate to the second plate, and wherein an aluminum-silicon foil interlayer is disposed between the second plate and the third plate for diffusion bonding the second plate to the third plate.

公开(公告)号：US20210331183A1

公开(公告)日：2021-10-28

申请号：US17240462

申请日：2021-04-26

Applicant: APPLIED MATERIALS, INC.

Inventor： Carlaton WONG ,  Reyn Tetsuro WAKABAYASHI

IPC: B05B1/18 ,  F16B37/04

Abstract: Embodiments of showerhead assemblies and fasteners for use in coupling components of showerhead assemblies are provided herein. More particularly, the fasteners described herein can advantageously be used to connect a gas distribution plate to a backing plate of the showerhead assembly. The fasteners described herein can further advantageously be used to robustly connect components together where the components have different coefficients of thermal expansion.

公开(公告)号：US20200370177A1

公开(公告)日：2020-11-26

申请号：US16876845

申请日：2020-05-18

Applicant: Applied Materials, Inc.

Inventor： Timothy Joseph FRANKLIN ,  Adam FISCHBACH ,  Edward HAYWOOD ,  Abhijit B. MALLICK ,  Pramit MANNA ,  Carlaton WONG ,  Stephen C. GARNER ,  Eswaranand VENKATASUBRAMANIAN

IPC: C23C16/458 ,  H01J37/32 ,  C23C16/46 ,  C23C16/455 ,  C23C16/50

Abstract: Embodiments of the present disclosure generally relate to apparatus and methods utilized in the manufacture of semiconductor devices. More particularly, embodiments of the present disclosure relate to a substrate processing chamber, and components thereof, for forming semiconductor devices.

公开(公告)号：US20240266152A1

公开(公告)日：2024-08-08

申请号：US18107487

申请日：2023-02-08

Applicant: Applied Materials, Inc.

Inventor： Michael Andrew STEARNS ,  Alok RANJAN ,  Kartik RAMASWAMY ,  Peng TIAN ,  Timothy Joseph FRANKLIN ,  Chris BLANK ,  Carlaton WONG

IPC: H01J37/32 ,  H01F27/28 ,  H01L21/3065

CPC classification number: H01J37/3266 ,  H01F27/28 ,  H01J37/3211 ,  H01L21/3065 ,  H01J2237/0264 ,  H01J2237/3341 ,  H01J2237/3343

Abstract: Embodiments of the present disclosure include an apparatus and methods for the plasma processing of a substrate. Some embodiments are directed to a plasma processing chamber. The plasma processing chamber generally includes a planar coil region comprising a concentric coil region comprising a first concentric coil and a second concentric coil, and a power supply circuit coupled to the first concentric coil and the second concentric coil. The first concentric coil may include a first coil with a diameter measured in a direction parallel to a first plane that is smaller than the diameter of a second coil included in the second concentric coil. The power supply circuit may be configured to bias the first concentric coil and the second concentric coil to adjust a generated magnetic field in a region of control of a plasma in the plasma processing chamber to control a plasma density of the plasma.

公开(公告)号：US20220293452A1

公开(公告)日：2022-09-15

申请号：US17688712

申请日：2022-03-07

Applicant: Applied Materials, Inc.

Inventor： Alexander SULYMAN ,  Carlaton WONG ,  Rajinder DHINDSA ,  Timothy Joseph FRANKLIN ,  Steven BABAYAN ,  Anwar HUSAIN ,  James Hugh ROGERS ,  Xue Yang CHANG

IPC: H01L21/687 ,  H01L21/683

Abstract: Methods and apparatus for a lift pin mechanism for substrate processing chambers are provided herein. In some embodiments, the lift pin mechanism includes a lift pin comprising a shaft with a top end, a bottom end, and a coupling end at the bottom end; a bellows assembly disposed about the shaft. The bellows assembly includes an upper bellows flange having an opening for axial movement of the shaft; a bellows having a first end coupled to a lower surface of the upper bellows flange such that the shaft extends into a central volume surrounded by the bellows; and a bellows guide assembly coupled to a second end of the bellows to seal the central volume. The shaft is coupled to the bellows guide assembly at the coupling end. The bellows guide assembly is axially movable to move the lift pin with respect to the upper bellows flange.

公开(公告)号：US20220293451A1

公开(公告)日：2022-09-15

申请号：US17688705

申请日：2022-03-07

Applicant: Applied Materials, Inc.

Inventor： Alexander SULYMAN ,  Anwar HUSAIN ,  Timothy Joseph FRANKLIN ,  Carlaton WONG ,  Xue Yang CHANG

IPC: H01L21/687 ,  H01L21/683

Abstract: Methods and apparatus for lift pin assemblies for substrate processing chambers are provided. In some embodiments, a lift pin assembly includes a lift pin comprising a shaft, a head, and a coupling end, the head configured to rest against an electrostatic chuck; an upper guide comprising a top end, a bottom end, and a first opening extending from the top end to the bottom end, wherein the shaft is disposed and axially movable through the first opening; a lower guide comprising a top end, a bottom end, and a second opening and a third opening extending from the top end to the bottom end, wherein the third opening is larger than the second opening, and wherein the shaft is disposed and axially movable through the second opening and the third opening; and a biasing mechanism coupled to the shaft and configured to bias the lift pin against the electrostatic chuck.