Electronic device with electromagnetic shielding structures
    1.
    发明授权
    Electronic device with electromagnetic shielding structures 有权
    具有电磁屏蔽结构的电子设备

    公开(公告)号:US09520645B2

    公开(公告)日:2016-12-13

    申请号:US14262574

    申请日:2014-04-25

    Applicant: Apple Inc.

    CPC classification number: H01Q1/526 H01Q1/243 H04B15/00

    Abstract: A wireless electronic device may be provided with components such as electrical and structural components. During transmission of radio-frequency signals, antennas and wireless communications circuitry of the wireless electronic device may produce associated time-varying magnetic fields. One or more components may be covered with magnetic-resistant shield structures that protect the components from the time-varying magnetic fields by preventing magnetic-induced vibrations. The magnetic-resistant shield structures may include a conductive base layer such a layer of brass. A magnetic-resistant layer may be plated onto the conductive base layer. The magnetic-resistant layer may be formed from an amorphous nickel-phosphorous alloy. The amorphous nickel-phosphorous alloy may be produced by controlling the manufacturing temperature and proportion of phosphorous in the alloy while performing the plating operations within a length of time that ensures non-equilibrium conditions during the plating operations.

    Abstract translation: 无线电子设备可以设置有诸如电气和结构部件的部件。 在射频信号的传输期间,无线电子设备的天线和无线通信电路可产生相关联的时变磁场。 一个或多个部件可以用防磁屏蔽结构覆盖,该结构通过防止磁致振动来保护部件免受时变磁场的影响。 磁性屏蔽结构可以包括导电基底层,例如黄铜层。 可以将耐磁层电镀到导电基底层上。 耐磁层可以由非晶镍 - 磷合金形成。 可以通过在确保电镀操作期间的非平衡条件的时间长度内进行电镀操作来控制合金中的磷的制造温度和比例来制造无定形镍 - 磷合金。

    Printed circuit board with integral radio-frequency shields
    2.
    发明授权
    Printed circuit board with integral radio-frequency shields 有权
    具有集成射频屏蔽的印刷电路板

    公开(公告)号:US09226435B2

    公开(公告)日:2015-12-29

    申请号:US14171623

    申请日:2014-02-03

    Applicant: Apple Inc.

    Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.

    Abstract translation: 诸如集成电路的电气部件可以安装在印刷电路板上。 为了防止电气部件受到电磁干扰,可以在部件上形成射频屏蔽结构。 射频屏蔽结构可以由一层金属涂料形成。 组件可以被一层电介质覆盖。 可以在电路块之间的电介质中形成通道。 金属涂料可用于涂覆电介质的表面并填充通道。 可以在金属涂料的表面中形成开口以将射频屏蔽彼此分开。 印刷电路板表面上的导电迹线可用于将金属漆层连接到内部印刷电路板迹线。

    Electronic Device With Electromagnetic Shielding Structures
    3.
    发明申请
    Electronic Device With Electromagnetic Shielding Structures 有权
    具有电磁屏蔽结构的电子装置

    公开(公告)号:US20150070236A1

    公开(公告)日:2015-03-12

    申请号:US14262574

    申请日:2014-04-25

    Applicant: Apple Inc.

    CPC classification number: H01Q1/526 H01Q1/243 H04B15/00

    Abstract: A wireless electronic device may be provided with components such as electrical and structural components. During transmission of radio-frequency signals, antennas and wireless communications circuitry of the wireless electronic device may produce associated time-varying magnetic fields. One or more components may be covered with magnetic-resistant shield structures that protect the components from the time-varying magnetic fields by preventing magnetic-induced vibrations. The magnetic-resistant shield structures may include a conductive base layer such a layer of brass. A magnetic-resistant layer may be plated onto the conductive base layer. The magnetic-resistant layer may be formed from an amorphous nickel-phosphorous alloy. The amorphous nickel-phosphorous alloy may be produced by controlling the manufacturing temperature and proportion of phosphorous in the alloy while performing the plating operations within a length of time that ensures non-equilibrium conditions during the plating operations.

    Abstract translation: 无线电子设备可以设置有诸如电气和结构部件的部件。 在射频信号的传输期间,无线电子设备的天线和无线通信电路可产生相关联的时变磁场。 一个或多个部件可以用防磁屏蔽结构覆盖,该结构通过防止磁致振动来保护部件免受时变磁场的影响。 磁性屏蔽结构可以包括导电基底层,例如黄铜层。 可以将耐磁层电镀到导电基底层上。 耐磁层可以由非晶镍 - 磷合金形成。 可以通过在确保电镀操作期间的非平衡条件的时间长度内进行电镀操作来控制合金中的磷的制造温度和比例来制造无定形镍 - 磷合金。

    Printed Circuit Board With Integral Radio-Frequency Shields
    4.
    发明申请
    Printed Circuit Board With Integral Radio-Frequency Shields 审中-公开
    具有整体射频屏蔽的印刷电路板

    公开(公告)号:US20140146495A1

    公开(公告)日:2014-05-29

    申请号:US14171623

    申请日:2014-02-03

    Applicant: Apple Inc.

    Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.

    Abstract translation: 诸如集成电路的电气部件可以安装在印刷电路板上。 为了防止电气部件受到电磁干扰,可以在部件上形成射频屏蔽结构。 射频屏蔽结构可以由一层金属涂料形成。 组件可以被一层电介质覆盖。 可以在电路块之间的电介质中形成通道。 金属涂料可用于涂覆电介质的表面并填充通道。 可以在金属涂料的表面中形成开口以将射频屏蔽彼此分开。 印刷电路板表面上的导电迹线可用于将金属漆层连接到内部印刷电路板迹线。

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