公开(公告)号：US20250096096A1

公开(公告)日：2025-03-20

申请号：US18469243

申请日：2023-09-18

Applicant: Apple Inc.

Inventor： Kumar Nagarajan ,  Flynn P. Carson ,  Karthik Shanmugam ,  Seongmin Lee

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16

Abstract: Electronic packages and methods of formation are described. In an embodiment, an electronic package includes one or more electronic components encapsulated in a step molded molding compound layer, and wiring layer spanning a lower step surface, sidewall, and top surface of the step molded molding compound layer. The wiring layer may further extend into a via opening extending through the lower step surface of the molding compound layer.

公开(公告)号：US20230238365A1

公开(公告)日：2023-07-27

申请号：US17582870

申请日：2022-01-24

Applicant: Apple Inc.

Inventor： Sidharth S. Dalmia ,  Kumar Nagarajan

IPC: H01L25/10 ,  H04B1/40 ,  H01L25/16 ,  H01L25/18 ,  H01L23/552

CPC classification number: H01L25/105 ,  H04B1/40 ,  H01L25/162 ,  H01L25/18 ,  H01L23/552 ,  H01L2225/1094 ,  H01L2225/1041 ,  H01L2225/1035 ,  H01L2225/1058

Abstract: A radio frequency package includes a baseband processor, a transceiver, and a memory. The baseband processor performs processing for wireless communication functions. Moreover, the transceiver transmits and receives wireless signals based on the processing of the wireless communication functions. Additionally, the memory is associated with the baseband processor and stores instructions for performing the processing. The memory and the baseband processor are disposed on top of the transceiver.

公开(公告)号：US12165956B2

公开(公告)日：2024-12-10

申请号：US17643247

申请日：2021-12-08

Applicant: Apple Inc.

Inventor： Kumar Nagarajan ,  Flynn P. Carson ,  Karthik Shanmugam ,  Menglu Li ,  Raymundo M. Camenforte ,  Scott D. Morrison

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/532 ,  H01L23/538 ,  H01L25/16 ,  H01L49/02

Abstract: Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.

公开(公告)号：US20230178458A1

公开(公告)日：2023-06-08

申请号：US17643247

申请日：2021-12-08

Applicant: Apple Inc.

Inventor： Kumar Nagarajan ,  Flynn P. Carson ,  Karthik Shanmugam ,  Menglu Li ,  Raymundo M. Camenforte ,  Scott D. Morrison

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/538 ,  H01L23/532 ,  H01L49/02

CPC classification number: H01L23/4952 ,  H01L23/31 ,  H01L23/5381 ,  H01L23/53228 ,  H01L28/00

Abstract: Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.