公开(公告)号：US20250096096A1

公开(公告)日：2025-03-20

申请号：US18469243

申请日：2023-09-18

Applicant: Apple Inc.

Inventor： Kumar Nagarajan ,  Flynn P. Carson ,  Karthik Shanmugam ,  Seongmin Lee

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16

Abstract: Electronic packages and methods of formation are described. In an embodiment, an electronic package includes one or more electronic components encapsulated in a step molded molding compound layer, and wiring layer spanning a lower step surface, sidewall, and top surface of the step molded molding compound layer. The wiring layer may further extend into a via opening extending through the lower step surface of the molding compound layer.