公开(公告)号：US12200424B1

公开(公告)日：2025-01-14

申请号：US17567416

申请日：2022-01-03

Applicant: Amazon Technologies, Inc.

Inventor： Chaoran Yang ,  Binbin Yang ,  Xin Zhao ,  Lei Wang ,  Fubin Song

IPC: H04R1/10 ,  H04R25/00 ,  H05K1/18

Abstract: Systems, methods, and computer-readable media are disclosed for capacitive touch sensing using system-in-package components and batteries. In one embodiment, a device may include a flexible printed circuit, a button cell electrically coupled to the flexible printed circuit, and a system-in-package that is electrically coupled to the flexible printed circuit. The system-in-package may include an electromagnetic interference shield, and a capacitive touch sensor. The capacitive touch sensor may be configured to detect a change in capacitance via a change in electric field at the electromagnetic interference shield.

公开(公告)号：US11900197B1

公开(公告)日：2024-02-13

申请号：US17483171

申请日：2021-09-23

Applicant: Amazon Technologies, Inc.

Inventor： Kun Tang ,  Fubin Song ,  Chaoran Yang

IPC: G06K19/07 ,  H01L23/552 ,  H01L25/065 ,  H01L21/56 ,  H01L25/10 ,  H02J50/10 ,  H01Q1/22 ,  G06K19/077 ,  H02J50/70

CPC classification number: G06K19/0723 ,  G06K19/07773 ,  H01L21/561 ,  H01L23/552 ,  H01L25/0655 ,  H01L25/105 ,  H01Q1/2225 ,  H01Q1/2283 ,  H02J50/10 ,  H02J50/70 ,  H01L2225/1023 ,  H01L2225/1047 ,  H01L2225/1058

Abstract: Systems and methods are disclosed for systems-in-packages that have multiple shielding components. In one embodiment, a system-in-package may include a substrate, an integrated circuit package disposed on the substrate, a system-on-a-chip disposed on the substrate, and a molding compound disposed over the integrated circuit package and the system-on-a-chip. The system-in-package may include a first electromagnetic interference shielding component disposed about the molding compound, and a second electromagnetic interference shielding component that at least partially forms an outer surface of the system-in-package. The second electromagnetic interference shielding component may have a patterned structure formed thereon.

公开(公告)号：US11775119B1

公开(公告)日：2023-10-03

申请号：US17224756

申请日：2021-04-07

Applicant: Amazon Technologies, Inc.

Inventor： Fubin Song ,  Chaoran Yang ,  Shoubao Wang ,  Lixin Wu ,  Cheng Xue

IPC: G06F3/044 ,  H05K1/02 ,  G06F1/18 ,  H05K9/00

CPC classification number: G06F3/044 ,  G06F1/182 ,  H05K1/023 ,  H05K9/0064 ,  G06F2203/04107 ,  H05K9/0071 ,  H05K2201/0707 ,  H05K2201/10151

Abstract: Systems, methods, and computer-readable media are disclosed for capacitive touch sensing using system-in-package components. In one embodiment, a device may include a flexible printed circuit, and a first system-in-package disposed on a first side of the flexible printed circuit. The first system-in-package may include a first molding compound, and a first electromagnetic interference shield disposed around an outer surface of the first molding compound. The device may include a first capacitive touch sensor, and a first stiffener disposed on a second side of the flexible printed circuit, where the first stiffener can be formed of a conductive material, and can be electrically coupled to both the flexible printed circuit and the first capacitive touch sensor. The first capacitive touch sensor may be configured to detect a change in capacitance via a change in electric field at the first electromagnetic interference shield.

公开(公告)号：US11372506B1

公开(公告)日：2022-06-28

申请号：US17103684

申请日：2020-11-24

Applicant: Amazon Technologies, Inc.

Inventor： Fubin Song ,  Chaoran Yang ,  Kun Tang ,  Xiaoman Li ,  Weitian Liu ,  Zhifan Gong

IPC: G06F3/044 ,  G06F3/041

Abstract: Systems, methods, and computer-readable media are disclosed for systems-in-packages that are encapsulated, at least partially, by a coating serving as electromagnetic interference (EMI) shielding, thereby isolating and otherwise protecting components in the systems-in-package from interference. The systems-in-packages may include one or more capacitive sensors in communication with a portion of the EMI shielding that serves as a sensing pad. In this manner, the system-in-package may benefit from EMI shielding and capacitive touch sensing capability without the complexity and increased cost of a separate capacitive touch sensor and sensing pad.

公开(公告)号：US11226415B1

公开(公告)日：2022-01-18

申请号：US17020010

申请日：2020-09-14

Applicant: Amazon Technologies, Inc.

Inventor： Fubin Song ,  Jun Ge ,  Jianhua Du ,  Ke Guo ,  Chaoran Yang

IPC: G01S17/86 ,  G01S7/481 ,  H04N13/254 ,  H04N5/225

Abstract: Systems, methods, and computer-readable media are disclosed for camera modules having integrated time of flight sensors. In one embodiment, an integrated sensor module may include a substrate, a molding compound disposed on the substrate, and a camera sensor disposed on the substrate. The integrated sensor module may include a vertical-cavity surface-emitting laser assembly (VCSEL) disposed on the molding compound and separated from the substrate by a first distance, and a single photon avalanche photodiode assembly (SPAD) disposed on the molding compound and separated from the substrate by the first distance. The camera sensor may be configured to detect a first portion of light emitted by the VCSEL and reflected from an object, and the SPAD may be configured to detect a second portion of light emitted by the VCSEL and reflected from the object.