公开(公告)号：US20240264368A1

公开(公告)日：2024-08-08

申请号：US18105702

申请日：2023-02-03

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Hung-Chun KUO ,  Jung Jui KANG ,  Chiu-Wen LEE ,  Shih-Yuan SUN ,  Chang Chi LEE ,  Chun-Yen TING

IPC分类号： G02B6/12

CPC分类号： G02B6/12004 ,  G02B2006/12109 ,  H04B10/25891

摘要： An optoelectronic device is provided. The optoelectronic device includes a plurality of first waveguides and a plurality of second waveguides. The plurality of first waveguides are configured to receive a first plurality of optical signals. The plurality of second waveguides are configured to transmit a second plurality of optical signals. The plurality of first waveguides extend substantially along a first direction and the plurality of second waveguides extend substantially along a second direction different from and non-parallel with the first direction.

公开(公告)号：US20240055365A1

公开(公告)日：2024-02-15

申请号：US17886254

申请日：2022-08-11

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Po-I WU ,  Jung Jui KANG ,  Chang Chi LEE ,  Pao-Nan LEE ,  Ming-Fong JHONG

IPC分类号： H01L23/552 ,  H01L23/48 ,  H01L23/66

CPC分类号： H01L23/552 ,  H01L23/481 ,  H01L23/66 ,  H01L2223/6616

摘要： An electronic device is disclosed. The electronic device includes a first interconnection structure, and a first electronic component disposed over the first interconnection structure and having an active surface and a lateral surface. The electronic device also includes a power connection disposed between the first interconnection structure and the active surface of the first electronic component, and a first non-power connection extending along the lateral surface of the first electronic component and electrically connected to the first interconnection structure. The electronic device also includes a second non-power connection disposed between the first interconnection structure and the active surface of the first electronic component. The second non-power connection is configured to block an electromagnetic interference (EMI) between the power connection and the first non-power connection.

公开(公告)号：US20240030125A1

公开(公告)日：2024-01-25

申请号：US17870676

申请日：2022-07-21

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Jung Jui KANG ,  Chang Chi LEE

IPC分类号： H01L23/522 ,  H01L23/528 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H01L23/00

CPC分类号： H01L23/5226 ,  H01L23/5286 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/13 ,  H01L24/19 ,  H01L2224/12105 ,  H01L2224/18

摘要： An electronic device is disclosed. The electronic device includes a first circuit structure, a first die, a second die, and a third die. The first die is disposed below the first circuit structure. The second die is disposed below the first circuit structure. The third die is disposed above the first circuit structure and electrically connects the first die to the second die. The first die communicates with the second die through the third die.

公开(公告)号：US20230081194A1

公开(公告)日：2023-03-16

申请号：US17472328

申请日：2021-09-10

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Jr-Wei LIN ,  Mei-Ju LU ,  Jung Jui KANG

IPC分类号： G02B6/43 ,  G02B6/42

摘要： An optoelectronic device includes a carrier, an electronic component, a photonic component and a supportive component. The electronic component is electrically coupled to the carrier. The photonic component is electrically coupled to the electronic component. The supportive component is disposed outside the photonic component and the electronic component and configured to support an optical component.

公开(公告)号：US20220392871A1

公开(公告)日：2022-12-08

申请号：US17338600

申请日：2021-06-03

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chang Chi LEE ,  Jung Jui KANG ,  Chiu-Wen LEE ,  Li Chieh CHEN

IPC分类号： H01L25/065 ,  H01L23/538

摘要： A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.

公开(公告)号：US20240345341A1

公开(公告)日：2024-10-17

申请号：US18135076

申请日：2023-04-14

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Jung Jui KANG ,  Shih-Yuan SUN ,  Chiu-Wen LEE ,  Chang Chi LEE ,  Chun-Yen TING ,  Hung-Chun KUO

IPC分类号： G02B6/42 ,  G02B6/43

CPC分类号： G02B6/4267 ,  G02B6/4257 ,  G02B6/43

摘要： A package device is provided. The package device includes a first die and a first through via structure. The first die has a first optical I/O. The first through via structure is over the first die. A first region of the first through via structure is configured to dissipate heat from the first die and a second region of the first through via structure is configured to transmit an optical signal to or from the first optical I/O.

公开(公告)号：US20240329344A1

公开(公告)日：2024-10-03

申请号：US18129769

申请日：2023-03-31

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Jung Jui KANG ,  Chiu-Wen LEE ,  Shih-Yuan SUN ,  Chang Chi LEE ,  Hung-Chun KUO ,  Chun-Yen TING

IPC分类号： G02B6/43 ,  G02B6/42 ,  H01L25/16

CPC分类号： G02B6/43 ,  G02B6/4206 ,  G02B6/4239 ,  H01L25/167

摘要： Semiconductor packages and methods for manufacturing the semiconductor packages are provided. The semiconductor package includes a first electronic element disposed over a first substrate; a second electronic element disposed over a second substrate spaced apart from the first substrate; and a first interconnection element connected to the first electronic element and the second electronic element. The first electronic element extends beyond an edge of the first substrate. The second electronic element extends beyond an edge of the second substrate and towards the first electronic element. The first interconnection element is configured to optically transmit a signal between the first electronic element and the second electronic element.

公开(公告)号：US20240213205A1

公开(公告)日：2024-06-27

申请号：US18088498

申请日：2022-12-23

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Jung Jui KANG ,  Shih-Yuan SUN ,  Chieh-Chen FU

IPC分类号： H01L23/00 ,  G02B6/42 ,  H01L23/31

CPC分类号： H01L24/29 ,  G02B6/4239 ,  G02B6/424 ,  G02B6/4253 ,  H01L23/3157 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204

摘要： A package is provided. The package includes a carrier, a component, and a first protective element. The component is disposed over the carrier and having a side surface configured for optically coupling. The first protective element is disposed between the carrier and the component. The side surface of the component is free from being in contact with the first protective element.

公开(公告)号：US20230420418A1

公开(公告)日：2023-12-28

申请号：US17846642

申请日：2022-06-22

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chun-Yen TING ,  Pao-Nan LEE ,  Jung Jui KANG ,  Chang Chi LEE

IPC分类号： H01L25/065

CPC分类号： H01L25/0657 ,  H01L2225/06544 ,  H01L2225/06558 ,  H01L2225/06589

摘要： An electronic device is provided. The electronic device includes a first die and a second die. The second die is disposed over the first die. A backside surface of the second die faces a backside surface of the first die. An active surface of the second die is configured to receive a first power. The second die is configured to provide the first die with a second power through the backside surface of the second die and the backside surface of the first die.

公开(公告)号：US20240332192A1

公开(公告)日：2024-10-03

申请号：US18128988

申请日：2023-03-30

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Po-I WU ,  Chun-Yen TING ,  Hung-Chun KUO ,  Jung Jui KANG ,  Chiu-Wen LEE ,  Shih-Yuan SUN

IPC分类号： H01L23/538 ,  G02B6/12 ,  H01L23/00 ,  H01L23/36 ,  H01L25/16

CPC分类号： H01L23/5381 ,  G02B6/12004 ,  H01L23/36 ,  H01L24/16 ,  H01L25/167 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204

摘要： A package structure is provided. The package structure includes a bridge component, a photonic processing unit, and an electrical device. The photonic processing unit is disposed over the bridge component. The electrical device is disposed over the bridge component. The bridge component is configured to optically couple with the photonic processing unit and electrically connect with the electronic component.