公开(公告)号：US20150348823A1

公开(公告)日：2015-12-03

申请号：US14450241

申请日：2014-08-02

Applicant: APPLIED MATERIALS, INC.

Inventor： BONNIE T. CHIA ,  JALLEPALLY RAVI ,  MANJUNATHA KOPPA ,  VINOD KONDA PURATHE ,  CHENG-HSIUNG MATTHEW TSAI ,  ARAVIND MIYAR KAMATH

IPC: H01L21/687

Abstract: Embodiments of lift pin assemblies are provided herein. In some embodiments, a lift pin assembly includes an elongate base formed of a first material and having a first feature formed in a distal end of the base to interface with and removably support a tip; and a tip formed of a second material different than the first material and having a support surface on a first side of the tip and an opposing second side of the tip, wherein the opposing second side includes a second feature to mate with the first feature of the base to removably retain the tip on the distal end of the base.

Abstract translation: 本文提供了提升销组件的实施例。 在一些实施例中，提升销组件包括由第一材料形成的细长基部，并且具有形成在基部的远端中的第一特征以与尖端相接合并可拆卸地支撑尖端; 以及由与所述第一材料不同的第二材料形成的尖端，并且在所述尖端的第一侧上具有支撑表面和所述尖端的相对的第二侧，其中所述相对的第二侧包括与所述第一特征相配合的第二特征 基部可移除地将尖端保持在基部的远端上。

公开(公告)号：US20160002778A1

公开(公告)日：2016-01-07

申请号：US14476238

申请日：2014-09-03

Applicant: APPLIED MATERIALS, INC.

Inventor： JALLEPALLY RAVI ,  TOMOHARU MATSUSHITA ,  ARAVIND MIYAR KAMATH ,  XIAOXIONG YUAN ,  CHENG-HSIUNG MATTHEW TSAI ,  MANJUNATHA KOPPA

IPC: C23C16/458 ,  C23C16/455 ,  C23C16/46

CPC classification number: C23C16/455 ,  C23C16/4586

Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support may include a first plate for supporting a substrate, the first plate having a plurality of purge gas channels on its backside; a second plate disposed beneath and supporting the first plate; and an edge ring surrounding the first plate and disposed above the second plate, wherein the plurality of purge gas channels extend from a single inlet in a central portion to a plurality of outlets at a periphery of the first plate, and wherein the plurality of purge gas channels have a substantially equal flow conductance.

Abstract translation: 本文提供了基板支撑件的实施例。 在一些实施例中，衬底支撑件可以包括用于支撑衬底的第一板，第一板在其背面具有多个吹扫气体通道; 设置在第一板下方并支撑第一板的第二板; 以及围绕所述第一板并设置在所述第二板上方的边缘环，其中所述多个吹扫气体通道从所述第一板的周边处的中心部分中的单个入口延伸到多个出口，并且其中所述多个吹扫 气体通道具有基本相等的流动电导。

公开(公告)号：US20160258061A1

公开(公告)日：2016-09-08

申请号：US14641378

申请日：2015-03-07

Applicant: APPLIED MATERIALS, INC.

Inventor： CHENG-HSIUNG TSAI ,  YOUQUN DONG ,  MANJUNATHA KOPPA

IPC: C23C16/458

Abstract: Apparatus for improving substrate temperature uniformity in a substrate processing chamber are provided herein. In some embodiments, a cover plate for a substrate processing chamber includes: an outer portion; and a raised inner portion having a thermally emissive layer, wherein a thermal emissivity of the thermally emissive layer varies across the thermally emissive layer.

Abstract translation: 本发明提供用于提高基板处理室中的基板温度均匀性的装置。 在一些实施例中，用于基板处理室的盖板包括：外部部分; 以及具有热发射层的升高的内部部分，其中热发射层的热辐射率在热发射层上变化。