专利检索 ap:("德克萨斯仪器股份有限公司") AND inv:"T·R·埃弗兰德" 第 1 页

1.

发明授权
将电路和引线框的功率分布功能集成到芯片表面上的电路结构失效

公开(公告)号：CN1269212C

公开(公告)日：2006-08-09

申请号：CN01135581.6

申请日：2001-10-15

申请人： 德克萨斯仪器股份有限公司

发明人： T·R·埃弗兰德

IPC分类号： H01L23/50 , H01L21/60

CPC分类号： H01L24/05 , H01L23/3171 , H01L23/50 , H01L23/5286 , H01L24/03 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/05669 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48669 , H01L2224/48724 , H01L2224/48739 , H01L2224/48764 , H01L2224/48769 , H01L2224/48839 , H01L2224/48844 , H01L2224/48864 , H01L2224/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01042 , H01L2924/01043 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01083 , H01L2924/014 , H01L2924/04941 , H01L2924/05042 , H01L2924/10253 , H01L2924/10329 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/20752 , H01L2924/00 , H01L2224/48824 , H01L2224/48869 , H01L2224/48744 , H01L2924/20753

摘要： 一种安装在引线框上的集成电路芯片，具有沉积在芯片表面上的功率分布线网络，使它们直接位于电路的有源元件之上；以及导电且垂直地连接到分布线之下的所选有源元件的分布线，还有连接到引线框的线段的导体，由此节省电路功率分布线和导体衬垫所消耗的硅地盘量，增加电路设计灵活性和组装制造能力，减少线段的输入/输出数目。

2.

发明公开
将电路和引线框的功率分布功能集成到芯片表面上的电路结构失效

公开(公告)号：CN1355567A

公开(公告)日：2002-06-26

申请号：CN01135581.6

申请日：2001-10-15

申请人： 德克萨斯仪器股份有限公司

发明人： T·R·埃弗兰德

IPC分类号： H01L23/50 , H01L21/60

CPC分类号： H01L24/05 , H01L23/3171 , H01L23/50 , H01L23/5286 , H01L24/03 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/05669 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48669 , H01L2224/48724 , H01L2224/48739 , H01L2224/48764 , H01L2224/48769 , H01L2224/48839 , H01L2224/48844 , H01L2224/48864 , H01L2224/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01042 , H01L2924/01043 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01083 , H01L2924/014 , H01L2924/04941 , H01L2924/05042 , H01L2924/10253 , H01L2924/10329 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/20752 , H01L2924/00 , H01L2224/48824 , H01L2224/48869 , H01L2224/48744 , H01L2924/20753

摘要： 一种安装在引线框上的集成电路芯片,具有沉积在芯片表面上的功率分布线网络,使它们直接位于电路的有源元件之上;以及导电且垂直地连接到分布线之下的所选有源元件的分布线,还有连接到引线框的线段的导体,由此节省电路功率分布线和导体衬垫所消耗的硅地盘量,增加电路设计灵活性和组装制造能力,减少线段的输入/输出数目。