- 专利标题： Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
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申请号： US14907478申请日： 2014-07-23
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公开(公告)号： US09955583B2公开(公告)日： 2018-04-24
- 发明人: Masafumi Ishii , Misato Honda , Nobuaki Miyamoto
- 申请人： JX NIPPON MINING & METALS CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： JX Nippon Mining & Metals Corporation
- 当前专利权人： JX Nippon Mining & Metals Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Drinker Biddle & Reath LLP
- 优先权： JP2013-153010 20130723; JP2013-153014 20130723; JP2013-160827 20130801; JP2013-160828 20130801
- 国际申请： PCT/JP2014/069489 WO 20140723
- 国际公布： WO2015/012327 WO 20150129
- 主分类号： B21C37/00
- IPC分类号： B21C37/00 ; H05K3/02 ; B32B15/08 ; B32B15/20 ; B32B3/26 ; C25D7/06 ; H05K3/20 ; H05K3/38 ; C23C18/16 ; H05K1/09 ; H05K3/42 ; C25D1/04 ; C25D3/38 ; C25D3/56 ; C25D3/58 ; C25D5/02 ; C25D5/10 ; C25D5/18 ; C25D5/34 ; C25D5/48 ; C23C18/40
摘要：
The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil having a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 μm.
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