Invention Grant
- Patent Title: Manufacturing method of dual gate oxide semiconductor TFT substrate and substrate thereof
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Application No.: US15650972Application Date: 2017-07-16
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Publication No.: US09947699B2Publication Date: 2018-04-17
- Inventor: Shimin Ge , Hejing Zhang , Chihyuan Tseng , Chihyu Su , Wenhui Li , Longqiang Shi , Xiaowen Lv
- Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Leong C. Lei
- Priority: CN201510175517 20150414
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L29/786 ; H01L27/12 ; H01L29/49 ; H01L29/24 ; H01L21/02 ; H01L27/32

Abstract:
A method for manufacturing a dual gate oxide semiconductor TFT substrate utilizes a halftone mask to implement a photo process, which not only accomplishes patterning to an oxide semiconductor layer but also obtains an oxide conductor layer with ion doping. The method implements patterning to a bottom gate isolation layer and a top gate isolation layer at the same time with one photolithographic process. The method implements patterning to second and third metal layers at the same time to obtain a first source, a first drain, a second source, a second drain, a first top gate and a second top gate with one photolithographic process. The method implements patterning to a second flat layer, a passivation layer and a top gate isolation layer at the same time with one photolithographic process. The number of photolithographic processes involved is reduced to nine so as to simplify the manufacturing process.
Public/Granted literature
- US20170317115A1 MANUFACTURING METHOD OF DUAL GATE OXIDE SEMICONDUCTOR TFT SUBSTRATE AND SUBSTRATE THEREOF Public/Granted day:2017-11-02
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