- 专利标题: Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
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申请号: US15473609申请日: 2017-03-30
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公开(公告)号: US09906700B2公开(公告)日: 2018-02-27
- 发明人: Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Nan Guo , Zhenyu Chen , Heng Jiang , Zhongyu Luan , Fengsheng Xi , Feifan Chen , Liang Ding
- 申请人: NINGBO SUNNY OPOTECH CO., LTD.
- 申请人地址: CN Ningbo, Zhejiang
- 专利权人: Ningbo Sunny Opotech Co., Ltd.
- 当前专利权人: Ningbo Sunny Opotech Co., Ltd.
- 当前专利权人地址: CN Ningbo, Zhejiang
- 代理机构: David and Raymond Patent Firm
- 代理商 Raymond Y. Chan
- 优先权: CN201610143457 20160312; CN201620191631U 20160312; CN201610149444 20160315; CN201620201261U 20160315; CN201610214411 20160407; CN201610669214 20160812; CN201620875781U 20160812; CN201620876056U 20160812
- 主分类号: H04N5/225
- IPC分类号: H04N5/225 ; G02B3/00 ; H05K1/18 ; G02B7/00 ; H05K1/02 ; G02B5/20 ; G02B7/02 ; H04M1/02 ; H01L27/146
摘要:
An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
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