发明授权
- 专利标题: Memory metal scheme
-
申请号: US15153872申请日: 2016-05-13
-
公开(公告)号: US09818752B2公开(公告)日: 2017-11-14
- 发明人: Derek C. Tao , Jacklyn Chang , Kuoyuan (Peter) Hsu , Yukit Tang
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Hauptman Ham, LLP
- 主分类号: G11C5/02
- IPC分类号: G11C5/02 ; G11C5/06 ; H01L27/11 ; H01L23/50 ; G11C11/418 ; G11C11/419 ; H01L23/522 ; H01L23/528 ; H01L27/02 ; H01L27/06
摘要:
A method of fabricating a memory includes forming a first portion of a first line in a first metal layer, forming a first portion of a second line in the first metal layer, forming a second portion of the first line in a second metal layer, and forming a second portion of the second line in a third metal layer. The first line is over a plurality of memory cells. The second line is over the plurality of memory cells, the first line is electrically isolated from the second line, and the first line and the second line extend in a same direction. The second metal layer is over the first metal layer. The third metal layer is over the second metal layer and the third metal layer is electrically isolated from the first line.
公开/授权文献
- US20160254267A1 MEMORY METAL SCHEME 公开/授权日:2016-09-01
信息查询