Invention Grant
- Patent Title: Radio frequency die package with inverted ground plane and method of making same
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Application No.: US15429227Application Date: 2017-02-10
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Publication No.: US09806390B2Publication Date: 2017-10-31
- Inventor: Yongjae Lee , Joseph Alfred Iannotti , Christopher Fred Keimel , Christopher James Kapusta
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Ziolkowski Patent Solutions Group, SC
- Agent Jean K. Testa
- Main IPC: H01P1/15
- IPC: H01P1/15 ; H01H57/00 ; H01L21/48 ; H01L21/52 ; H01L21/54 ; H01L21/56 ; H01H59/00 ; H01H61/01 ; H01H55/00 ; H01H61/00
Abstract:
A radio frequency (RF) die package includes a switch assembly comprising an RF transmission line and a plurality of conductive mounting pads formed on a first substrate. A switching mechanism selectively couples a first portion of the RF transmission line to a second portion of the RF transmission line. An inverted ground plane assembly is coupled to the plurality of conductive mounting pads such that an electromagnetic field generated between the RF transmission line and the inverted ground plane assembly does not permeate the first substrate in a region of the switch assembly proximate the switching mechanism.
Public/Granted literature
- US20170155179A1 RADIO FREQUENCY DIE PACKAGE WITH INVERTED GROUND PLANE AND METHOD OF MAKING SAME Public/Granted day:2017-06-01
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