Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
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Application No.: US15176611Application Date: 2016-06-08
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Publication No.: US09716181B2Publication Date: 2017-07-25
- Inventor: Phil Ouk Nam , Yong-Hoon Son , Kyunghyun Kim , Byeongju Kim , Kwangchul Park , Yeon-Sil Sohn , Jin-l Lee , JongHeun Lim , Wonbong Jung
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: Lee & Morse P.C.
- Priority: KR10-2015-0104487 20150723
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L29/10 ; H01L31/036 ; H01L29/786 ; H01L27/12

Abstract:
A semiconductor device includes a polycrystalline semiconductor layer on a substrate, first and second stacks on the polycrystalline semiconductor layer, the first and second stacks extending in a first direction, a separation trench between the first and second stacks and extending in the first direction, the separation trench separating the first and second stacks in a second direction crossing the first direction, and vertical channel structures vertically passing through each of the first and second stacks, wherein the polycrystalline semiconductor layer includes a first grain region and a second grain region in contact with each other, the first and second grain region being adjacent to each other along the second direction, and wherein each of the first and second grain regions includes a plurality of crystal grains, each crystal grain having a longitudinal axis parallel to the second direction.
Public/Granted literature
- US20170025545A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2017-01-26
Information query
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