- 专利标题: Ion implantation method and ion implantation apparatus
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申请号: US13710174申请日: 2012-12-10
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公开(公告)号: US09646837B2公开(公告)日: 2017-05-09
- 发明人: Shiro Ninomiya , Yasuharu Okamoto , Masaki Ishikawa , Takeshi Kurose , Akihiro Ochi
- 申请人: SEN Corporation
- 申请人地址: JP Shinagawa
- 专利权人: SEN CORPORATION
- 当前专利权人: SEN CORPORATION
- 当前专利权人地址: JP Shinagawa
- 代理机构: Arent Fox LLP
- 优先权: JP2011-277427 20111219
- 主分类号: H01J37/304
- IPC分类号: H01J37/304 ; H01J37/317 ; H01L21/265
摘要:
An ion implantation method includes transporting ions to a wafer as an ion beam, causing the wafer to undergo wafer mechanical slow scanning and also causing the ion beam to undergo beam fast scanning or causing the wafer to undergo wafer mechanical fast scanning in a direction perpendicular to a wafer slow scanning direction, irradiating the wafer with the ion beam by using the wafer slow scanning in the wafer slow scanning direction and the beam fast scanning of the ion beam or the wafer fast scanning of the wafer in the direction perpendicular to the wafer slow scanning direction, measuring a two-dimensional beam shape of the ion beam before ion implantation into the wafer, and defining an implantation and irradiation region of the ion beam by using the measured two-dimensional beam shape to thereby regulate the implantation and irradiation region.
公开/授权文献
- US20130157390A1 ION IMPLANTATION METHOD AND ION IMPLANTATION APPARATUS 公开/授权日:2013-06-20
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