发明授权
- 专利标题: Structure with emedded EFS3 and FinFET device
- 专利标题(中): 具有EFS3和FinFET器件的结构
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申请号: US14749970申请日: 2015-06-25
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公开(公告)号: US09570454B2公开(公告)日: 2017-02-14
- 发明人: Ming Chyi Liu , Chang-Ming Wu , Shih-Chang Liu , Yu-Hsing Chang , Yuan-Tai Tseng
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Eschweiler & Associates, LLC
- 主分类号: H01L27/115
- IPC分类号: H01L27/115 ; H01L29/78 ; H01L29/423 ; H01L29/10
摘要:
The present disclosure relates to an integrated chip having a FinFET device and an embedded flash memory device, and a method of formation. In some embodiments, the integrated chip has a logic region and a memory region that is laterally separated from the logic region. The logic region has a first plurality of fins of semiconductor material protruding outward from a semiconductor substrate. A gate electrode is arranged over the first plurality of fins of semiconductor material. The memory region has a second plurality of fins of semiconductor material extending outward from the semiconductor substrate. An embedded flash memory cell is arranged onto the second plurality of fins of semiconductor material. The resulting integrated chip structure provides for good performance since it contains both a FinFET device and an embedded flash memory device.
公开/授权文献
- US20160379987A1 STRUCTURE WITH EMEDDED EFS3 AND FINFET DEVICE 公开/授权日:2016-12-29
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