Invention Grant
- Patent Title: Method of fabricating semiconductor package
- Patent Title (中): 制造半导体封装的方法
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Application No.: US14716272Application Date: 2015-05-19
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Publication No.: US09418874B2Publication Date: 2016-08-16
- Inventor: Wan-Ting Chen , Mu-Hsuan Chan , Yi-Chian Liao , Chun-Tang Lin , Yi-Che Lai
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW101126923A 20120726
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/56 ; H01L23/28 ; H01L23/538 ; H01L23/31 ; H01L23/00 ; H01L23/498 ; H01L21/78
Abstract:
A semiconductor package is provided, including: a carrier; at least an interposer disposed on the carrier; an encapsulant formed on the carrier for encapsulating the interposer while exposing a top side of the interposer; a semiconductor element disposed on the top side of the interposer; and an adhesive formed between the interposer and the semiconductor element. By encapsulating the interposer with the encapsulant, warpage of the interposer is avoided and a planar surface is provided for the semiconductor element to be disposed thereon, thereby improving the reliability of electrical connection between the interposer and the semiconductor element.
Public/Granted literature
- US20150255311A1 METHOD OF FABRICATING SEMICONDUCTOR PACKAGE Public/Granted day:2015-09-10
Information query
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