发明授权
- 专利标题： Semiconductor device and method for manufacturing the semiconductor device
- 专利标题（中）： 半导体装置及其制造方法
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申请号： US14275137申请日： 2014-05-12
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公开(公告)号： US09406603B2公开(公告)日： 2016-08-02
- 发明人: Tatsuo Nishizawa , Shinji Tada , Yoshito Kinoshita , Yoshinari Ikeda , Eiji Mochizuki
- 申请人： FUJI ELECTRIC CO., LTD.
- 申请人地址： JP Kawasaki-shi
- 专利权人： FUJI ELECTRIC CO., LTD.
- 当前专利权人： FUJI ELECTRIC CO., LTD.
- 当前专利权人地址： JP Kawasaki-shi
- 代理机构： Rossi, Kimms & McDowell LLP
- 优先权： JP2011-272902 20111214
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L23/40 ; H01L23/522 ; H01L25/07 ; H01L23/498 ; H01L23/00 ; H01L23/373 ; H01L23/433 ; H01L21/48 ; H01L21/768 ; H01L23/24
摘要：
A semiconductor device is disclosed in which an implant board and a semiconductor element of a semiconductor mounting board are bonded and electrically connected through implant pins and which can be manufactured with high productivity. Implant pins are bonded to a semiconductor element and/or a circuit pattern of a semiconductor mounting board through cylindrical terminals press-fitted into the other ends of the implant pins. Press-fitting depth L2 of each of the implant pins into corresponding cylindrical terminals is adjustable, so that total length of the implant pin and cylindrical terminal which are press-fitted to each other matches up with the distance between the semiconductor element and/or the circuit pattern on the semiconductor mounting board and an implant board.
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