发明授权
US09384972B2 Method of manufacturing semiconductor device by forming a film on a substrate
有权
通过在基板上形成膜来制造半导体器件的方法
- 专利标题: Method of manufacturing semiconductor device by forming a film on a substrate
- 专利标题(中): 通过在基板上形成膜来制造半导体器件的方法
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申请号: US14681318申请日: 2015-04-08
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公开(公告)号: US09384972B2公开(公告)日: 2016-07-05
- 发明人: Yushin Takasawa , Hajime Karasawa , Yoshiro Hirose
- 申请人: Hitachi-Kokusai Electric Inc.
- 申请人地址: JP Tokyo
- 专利权人: Hitachi Kokusai Electric Inc.
- 当前专利权人: Hitachi Kokusai Electric Inc.
- 当前专利权人地址: JP Tokyo
- 代理机构: Brundidge & Stanger, P.C.
- 优先权: JP2008-300891 20081126; JP2009-246707 20091027
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; C23C16/455 ; H01L21/314 ; H01L21/318 ; C23C16/46 ; C23C16/52 ; C23C16/50 ; C23C14/54 ; C23C28/00
摘要:
Provided is a technique of forming a film on a substrate by performing a cycle a predetermined number of times. The cycle includes: forming a first layer by supplying a gas containing a first element to the substrate, wherein the first layer is a discontinuous layer, a continuous layer, or a layer in which at least one of the discontinuous layer or the continuous layer is overlapped; forming a second layer by supplying a gas containing a second element to the substrate to modify the first layer under a condition where a modifying reaction of the first layer by the gas containing the second element is not saturated; and forming a third layer by supplying a gas containing a third element to the substrate to modify the second layer under a condition where a modifying reaction of the second layer by the gas containing the third element is not saturated.
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