Invention Grant
- Patent Title: Coated bonding wire and methods for bonding using same
- Patent Title (中): 涂覆粘合线及使用其的接合方法
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Application No.: US14529744Application Date: 2014-10-31
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Publication No.: US09368470B2Publication Date: 2016-06-14
- Inventor: Chu-Chung Lee , Burton J. Carpenter , Tu-Anh N. Tran
- Applicant: FREESCALE SEMICONDUCTOR, INC.
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/44 ; H01L23/00 ; H01L23/31
Abstract:
A semiconductor device includes a bond formed on a bond pad. The bond is formed of a wire that includes a central core of conductive metal, a first coating over the central core of conductive metal that is more chemically active than the conductive metal, and a second coating over the central core of conductive metal that is less chemically active than the central core of conductive metal.
Public/Granted literature
- US20160126208A1 COATED BONDING WIRE AND METHODS FOR BONDING USING SAME Public/Granted day:2016-05-05
Information query
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