Invention Grant
- Patent Title: Method of forming semiconductor device
- Patent Title (中): 半导体器件形成方法
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Application No.: US14333908Application Date: 2014-07-17
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Publication No.: US09130037B2Publication Date: 2015-09-08
- Inventor: Jae-June Jang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2012-0124424 20121105
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L29/78 ; H01L21/02 ; H01L21/762 ; H01L29/06 ; H01L29/10 ; H01L29/66

Abstract:
A semiconductor device may include a semiconductor substrate, a first conductive type well and a second conductive type drift region in the semiconductor substrate, the drift region including a first drift doping region and a second drift doping region, the second drift doping region vertically overlapping the well, and a first conductive type body region in the well, the body region being in contact with a side of the first drift doping region. The first drift doping region and the second doping region may include a first conductive type dopant and a second conductive type dopant, and an average density of the first conductive type dopant in the first drift doping region may be less than an average density of the first conductive type dopant in the second drift doping region.
Public/Granted literature
- US20140339637A1 METHOD OF FORMING SEMICONDUCTOR DEVICE Public/Granted day:2014-11-20
Information query
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