发明授权
- 专利标题： Polishing pad for eddy current end-point detection
- 专利标题（中）： 用于涡流端点检测的抛光垫
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申请号： US14099655申请日： 2013-12-06
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公开(公告)号： US09028302B2公开(公告)日： 2015-05-12
- 发明人: William C. Allison , Diane Scott , Ping Huang , Richard Frentzel , Alexander William Simpson
- 申请人： William C. Allison , Diane Scott , Ping Huang , Richard Frentzel , Alexander William Simpson
- 申请人地址： US OR Hillsboro
- 专利权人： NexPlanar Corporation
- 当前专利权人： NexPlanar Corporation
- 当前专利权人地址： US OR Hillsboro
- 代理机构： Blakely Sokoloff Taylor Zafman LLP
- 主分类号： B24D18/00
- IPC分类号： B24D18/00 ; B24D11/00 ; B24B37/013 ; B24B37/20 ; B24B49/10
摘要：
Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.
公开/授权文献
- US20140102010A1 Polishing Pad for Eddy Current End-Point Detection 公开/授权日：2014-04-17
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