Invention Grant
- Patent Title: Methods for forming interconnection line using screen printing technique
- Patent Title (中): 使用丝网印刷技术形成互连线的方法
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Application No.: US13719082Application Date: 2012-12-18
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Publication No.: US08951810B2Publication Date: 2015-02-10
- Inventor: Kyu Won Lee , Cheol Ho Joh , Ji Eun Kim , Hee Min Shin , Chong Ho Cho
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: KR10-2012-0093856 20120827
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/48 ; H01L23/498
Abstract:
Methods of forming an interconnection line pattern using a screen printing technique. The method includes preparing a substrate having unevenness, aligning a stencil mask on the substrate, and printing a paste including materials for forming the interconnection line pattern on a convex portion of the unevenness formed on the substrate.
Public/Granted literature
- US20140057369A1 METHODS FOR FORMING INTERCONNECTION LINE USING SCREEN PRINTING TECHNIQUE Public/Granted day:2014-02-27
Information query
IPC分类:
