Invention Grant
US08835316B2 Transistor with primary and semiconductor spacer, method for manufacturing transistor, and semiconductor chip comprising the transistor
有权
具有初级和半导体衬垫的晶体管,晶体管的制造方法和包括晶体管的半导体芯片
- Patent Title: Transistor with primary and semiconductor spacer, method for manufacturing transistor, and semiconductor chip comprising the transistor
- Patent Title (中): 具有初级和半导体衬垫的晶体管,晶体管的制造方法和包括晶体管的半导体芯片
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Application No.: US13378997Application Date: 2011-08-09
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Publication No.: US08835316B2Publication Date: 2014-09-16
- Inventor: Haizhou Yin , Jun Luo , Huilong Zhu , Zhijiong Luo
- Applicant: Haizhou Yin , Jun Luo , Huilong Zhu , Zhijiong Luo
- Applicant Address: CN
- Assignee: Institute of Microelectronics, Chinese Academy of Sciences
- Current Assignee: Institute of Microelectronics, Chinese Academy of Sciences
- Current Assignee Address: CN
- Agency: Martine Penilla Group, LLP
- Priority: CN201110188060 20110706
- International Application: PCT/CN2011/001309 WO 20110809
- International Announcement: WO2013/003986 WO 20130110
- Main IPC: H01L29/772
- IPC: H01L29/772 ; H01L21/3213 ; H01L21/768 ; H01L29/78 ; H01L29/66 ; H01L29/417 ; H01L21/285

Abstract:
The disclosure provides a transistor, a method for manufacturing the transistor, and a semiconductor chip comprising the transistor. The transistor comprises: an active area, a gate stack, a primary spacer, and source/drain regions, wherein the active area is on a semiconductor substrate; the gate stack, the primary spacer, and the source/drain regions are on the active area; the primary spacer surrounds the gate stack; the source/drain regions are embedded in the active area and self-aligned with opposite sides of the primary spacer. Wherein the transistor further comprises: a silicide spacer, wherein the silicide spacer is located at opposite sides of the primary spacer, and a dielectric material is filled between the two ends of the silicide spacer in the width direction of the gate stack, so as to isolate the source/drain regions from each other.
Public/Granted literature
- US20130009217A1 Transistor, Method for Manufacturing Transistor, and Semiconductor Chip Comprising the Transistor Public/Granted day:2013-01-10
Information query
IPC分类: