Invention Grant
- Patent Title: Semiconductor structure and process thereof
- Patent Title (中): 半导体结构及其工艺
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Application No.: US13727540Application Date: 2012-12-26
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Publication No.: US08829575B2Publication Date: 2014-09-09
- Inventor: Chung-Fu Chang , Yu-Hsiang Hung , Chia-Jong Liu , Yen-Liang Wu , Pei-Yu Chou , Home-Been Cheng
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L29/78
- IPC: H01L29/78

Abstract:
A semiconductor structure includes a gate, a dual spacer and two recesses. The gate is located on a substrate. The dual spacer is located on the substrate beside the gate. The recesses are located in the substrate and the dual spacers, wherein the sidewall of each of the recesses next to the gate has a lower tip and an upper tip, and the lower tip is located in the substrate while the upper tip is an acute angle located in the dual spacer and close to the substrate. The present invention also provides a semiconductor process formed said semiconductor structure.
Public/Granted literature
- US20140175527A1 SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF Public/Granted day:2014-06-26
Information query
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