Invention Grant
- Patent Title: Adjusting sizes of connectors of package components
- Patent Title (中): 调整包装组件连接器的尺寸
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Application No.: US13299100Application Date: 2011-11-17
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Publication No.: US08791579B2Publication Date: 2014-07-29
- Inventor: Chih-Wei Lai , Ming-Che Ho , Tzong-Hann Yang , Chien Rhone Wang , Chia-Tung Chang , Hung-Jui Kuo , Chung-Shi Liu
- Applicant: Chih-Wei Lai , Ming-Che Ho , Tzong-Hann Yang , Chien Rhone Wang , Chia-Tung Chang , Hung-Jui Kuo , Chung-Shi Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater and Matsil, L.L.P.
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/48 ; H01L23/485 ; H01L23/495
Abstract:
A device includes a plurality of connectors on a top surface of a package component. The plurality of connectors includes a first connector having a first lateral dimension, and a second connector having a second lateral dimension. The second lateral dimension is greater than the first lateral dimension. The first and the second lateral dimensions are measured in directions parallel to a major surface of the package component.
Public/Granted literature
- US20130127059A1 Adjusting Sizes of Connectors of Package Components Public/Granted day:2013-05-23
Information query
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