Invention Grant
- Patent Title: LDMOS with improved breakdown voltage
- Patent Title (中): LDMOS具有改善的击穿电压
-
Application No.: US13046313Application Date: 2011-03-11
-
Publication No.: US08748271B2Publication Date: 2014-06-10
- Inventor: Eng Huat Toh , Jae Gon Lee , Chung Foong Tan , Elgin Quek
- Applicant: Eng Huat Toh , Jae Gon Lee , Chung Foong Tan , Elgin Quek
- Applicant Address: SG Singapore
- Assignee: Globalfoundries Singapore Pte. Ltd.
- Current Assignee: Globalfoundries Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ditthavong Mori & Steiner, P.C.
- Main IPC: H01L29/772
- IPC: H01L29/772 ; H01L29/40 ; H01L29/49 ; H01L29/78 ; H01L29/51 ; H01L29/66 ; H01L29/423

Abstract:
An LDMOS is formed with a field plate over the n− drift region, coplanar with the gate stack, and having a higher work function than the gate stack. Embodiments include forming a first conductivity type well, having a source, surrounded by a second conductivity type well, having a drain, in a substrate, forming first and second coplanar gate stacks on the substrate over a portion of the first well and a portion of the second well, respectively, and tuning the work functions of the first and second gate stacks to obtain a higher work function for the second gate stack. Other embodiments include forming the first gate stack of a high-k metal gate and the second gate stack of a field plate on a gate oxide layer, forming the first and second gate stacks with different gate electrode materials on a common gate oxide, and forming the gate stacks separated from each other and with different gate dielectric materials.
Public/Granted literature
- US20120228695A1 LDMOS WITH IMPROVED BREAKDOWN VOLTAGE Public/Granted day:2012-09-13
Information query
IPC分类: