A semiconductor chip includes a composite bond pad that is electrically connected to at least one integrated circuit device. The composite bond pad includes a first bond pad portion having a first upper surface corresponding to a first surface area that is defined by a first substantially regular geometric shape when viewed from above that has a first area centroid that is located a first distance from a center of the semiconductor chip, and further includes a second bond pad portion positioned above the first upper surface and having a second upper surface that extends above the first upper surface, the second portion corresponding to a second surface area that is defined by at least a part of a second substantially regular geometric shape when viewed from above that has a second area centroid that is located a second distance from the center that is greater than the first distance.