发明授权
US08166445B1 Estimating Icc current temperature scaling factor of an integrated circuit
有权
估计集成电路的Icc当前温度比例因子
- 专利标题： Estimating Icc current temperature scaling factor of an integrated circuit
- 专利标题（中）： 估计集成电路的Icc当前温度比例因子
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申请号： US12558109申请日： 2009-09-11
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公开(公告)号： US08166445B1公开(公告)日： 2012-04-24
- 发明人: Cinti X. Chen , Yongjun Zheng , Joe W. Zhao
- 申请人： Cinti X. Chen , Yongjun Zheng , Joe W. Zhao
- 申请人地址： US CA San Jose
- 专利权人： Xilinx, Inc.
- 当前专利权人： Xilinx, Inc.
- 当前专利权人地址： US CA San Jose
- 代理商 LeRoy D. Maunu
- 主分类号： G06F17/50
- IPC分类号： G06F17/50
摘要：
An embodiment of the present invention reduces resources needed to estimate the Icc Current Temperature Scaling Factor (ITSF) of a device, and provides a method and apparatus to estimate ITSF from the device speed and performance characteristics which can be measured at room temperature. In one embodiment, a method for estimating the ITSF of an integrated circuit includes: determining a level of propagation delay of a portion of the integrated circuit; and determining an estimated Icc current temperature scaling factor from a correlation between the level of the propagation delay and a modeled Icc current temperature scaling factor.
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