公开(公告)号：US08166445B1

公开(公告)日：2012-04-24

申请号：US12558109

申请日：2009-09-11

Applicant: Cinti X. Chen ,  Yongjun Zheng ,  Joe W. Zhao

Inventor： Cinti X. Chen ,  Yongjun Zheng ,  Joe W. Zhao

IPC: G06F17/50

CPC classification number: G06F17/5036

Abstract: An embodiment of the present invention reduces resources needed to estimate the Icc Current Temperature Scaling Factor (ITSF) of a device, and provides a method and apparatus to estimate ITSF from the device speed and performance characteristics which can be measured at room temperature. In one embodiment, a method for estimating the ITSF of an integrated circuit includes: determining a level of propagation delay of a portion of the integrated circuit; and determining an estimated Icc current temperature scaling factor from a correlation between the level of the propagation delay and a modeled Icc current temperature scaling factor.

Abstract translation: 本发明的实施例减少了估计装置的Icc电流温度比例因子（ITSF）所需的资源，并且提供了一种从室温下测量的装置速度和性能特征估计ITSF的方法和装置。 在一个实施例中，用于估计集成电路的ITSF的方法包括：确定集成电路的一部分的传播延迟的水平; 以及根据传播延迟的电平和建模的Icc当前温度比例因子之间的相关性来确定估计的Icc当前温度比例因子。

公开(公告)号：US08000519B1

公开(公告)日：2011-08-16

申请号：US11732859

申请日：2007-04-04

Applicant: Yongjun Zheng ,  David Mark ,  Joe W. Zhao ,  Felino Encarnacion Pagaduan

Inventor： Yongjun Zheng ,  David Mark ,  Joe W. Zhao ,  Felino Encarnacion Pagaduan

IPC: G06K9/00

CPC classification number: H01L22/12

Abstract: A method of evaluating an inline inspection recipe compares the capture rate of metal pattern defects in bounding boxes arising from failed electrical test vectors to the capture rate after the bounding box is shifted. A difference between the first and second capture rates indicates whether the inline inspection recipe is valid for capturing killer defects, or if the inline inspection recipe needs to be adjusted. In a particular example, the electrical test vectors are directed at a selected patterned metal layer of an FPGA (M6), and the metal pattern defect data for the selected patterned metal layer is mapped to the bounding box determined by the electrical test vector.

Abstract translation: 评估在线检查配方的方法将由故障电测试矢量引起的界限框中的金属图案缺陷的捕获率与边界框移位后的捕获率进行比较。 第一和第二捕获率之间的差异表明内联检查配方是否有效捕获杀伤瑕疵，或者是否需要调整内联检查配方。 在特定示例中，电测试向量指向FPGA（M6）的选定的图案化金属层，并且所选择的图案化金属层的金属图案缺陷数据被映射到由电测试矢量确定的边界框。