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发明授权
US08110913B2 Integrated circuit package system with integral inner lead and paddle 有权
集成电路封装系统，内置内部引线和桨

Integrated circuit package system with integral inner lead and paddle
摘要：
An integrated circuit package system includes: fabricating a lead frame including: providing inner leads having an inner lead pitch of progressive length, forming a lead shoulder, on the inner leads, having a shoulder height of a progressive height, and forming outer leads coupled to the lead shoulder and the inner leads; mounting an integrated circuit die on the lead frame; and molding a package body on the lead frame and the integrated circuit die.
摘要（中）：

集成电路封装系统包括：制造引线框架，其包括：提供具有渐进长度的内引线间距的内引线，在内引线上形成引线肩部，具有渐进高度的肩高，以及形成外引线， 铅肩和内引线; 在引线框架上安装集成电路管芯; 以及在引线框架和集成电路管芯上成型封装体。

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