发明授权
- 专利标题: Edge termination for semiconductor devices
- 专利标题(中): 半导体器件的边缘端接
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申请号: US12418808申请日: 2009-04-06
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公开(公告)号: US07911021B2公开(公告)日: 2011-03-22
- 发明人: Amit Paul , Mohamed N. Darwish , Jun Zeng
- 申请人: Amit Paul , Mohamed N. Darwish , Jun Zeng
- 申请人地址: US CA Santa Clara
- 专利权人: Maxpower Semiconductor Inc.
- 当前专利权人: Maxpower Semiconductor Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Groover & Associates
- 代理商 Robert Groover
- 主分类号: H01L29/02
- IPC分类号: H01L29/02
摘要:
A high-voltage termination structure includes a peripheral voltage-spreading network. One or more trench structures are connected at least partly in series between first and second power supply voltages. The trench structures include first and second current-limiting structures connected in series with a semiconductor material, and also includes permanent charge in a trench-wall dielectric. The current-limiting structures in the trench structures are jointly connected in a series-parallel ladder configuration. The current-limiting structures, in combination with the semiconductor material, provide a voltage distribution between the core portion and the edge portion.
公开/授权文献
- US20090294892A1 Edge Termination for Semiconductor Devices 公开/授权日:2009-12-03
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