发明授权
- 专利标题： Method for providing whisker-free aluminum metal lines or aluminum alloy lines in integrated circuits
- 专利标题（中）： 在集成电路中提供无晶须的铝金属线或铝合金线的方法
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申请号： US10868309申请日： 2004-06-15
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公开(公告)号： US07157381B2公开(公告)日： 2007-01-02
- 发明人: Dirk Efferenn , Jens Hahn , Uwe Kahler , Chung-Hsin Lin , Jens Bachmann , Wen-Bin Lin , Grit Bonsdorf
- 申请人： Dirk Efferenn , Jens Hahn , Uwe Kahler , Chung-Hsin Lin , Jens Bachmann , Wen-Bin Lin , Grit Bonsdorf
- 申请人地址： DE Munich TW Taoyuan
- 专利权人： Infineon Technologies AG,Nanya Technology Corporation
- 当前专利权人： Infineon Technologies AG,Nanya Technology Corporation
- 当前专利权人地址： DE Munich TW Taoyuan
- 代理商 Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- 主分类号： H01L21/302
- IPC分类号： H01L21/302
摘要：
A method for providing whisker-free aluminum metal lines or aluminum alloy lines in integrated circuits includes the following steps: providing a substrate; providing a whisker-containing layer made of aluminum metal or an aluminum alloy on the substrate; back-etching and/or resputtering the whisker-containing layer such that the whiskers are essentially removed; and structuring the whisker-free layer into the lines.
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