发明授权
- 专利标题: Method for fabricating transistor with polymetal gate electrode
- 专利标题(中): 用多金属栅电极制造晶体管的方法
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申请号: US10750084申请日: 2003-12-30
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公开(公告)号: US07029999B2公开(公告)日: 2006-04-18
- 发明人: Kwan-Yong Lim , Byung-Seop Hong , Heung-Jae Cho , Jung-Ho Lee , Jae-Geun Oh , Yong-Soo Kim , Se-Aug Jang , Hong-Seon Yang , Hyun-Chul Sohn
- 申请人: Kwan-Yong Lim , Byung-Seop Hong , Heung-Jae Cho , Jung-Ho Lee , Jae-Geun Oh , Yong-Soo Kim , Se-Aug Jang , Hong-Seon Yang , Hyun-Chul Sohn
- 申请人地址: KR Ichon-shi
- 专利权人: Hynix Semiconductor Inc.
- 当前专利权人: Hynix Semiconductor Inc.
- 当前专利权人地址: KR Ichon-shi
- 代理机构: Townsend and Townsend and Crew LLP
- 优先权: KR10-2003-0043055 20030630
- 主分类号: H01L21/4763
- IPC分类号: H01L21/4763 ; H01L21/44
摘要:
The present invention is related to a method for fabricating a transistor with a polymetal gate electrode structure. The method includes the steps of: forming a gate insulation layer on a substrate; forming a patterned gate stack structure on the gate insulation layer, wherein the patterned stack structure includes a polysilicon layer as a bottom layer and a metal layer as an upper layer; forming a silicon oxide-based capping layer along a profile containing the patterned gate stack structure and on the gate insulation layer at a predetermined temperature that prevents oxidation of the metal layer; and performing a gate re-oxidation process.
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