发明授权
US4213840A Low-resistance, fine-line semiconductor device and the method for its manufacture 失效
低电阻,细线半导体器件及其制造方法

Low-resistance, fine-line semiconductor device and the method for its
manufacture
摘要:
A method of fabricating gate electrodes on microwave field effect transistors is described. A first layer of photo-resist is deposited and photolithographically defined on top of a semiconductor material with openings in the photoresist, corresponding to the gate electrode. In one embodiment, when drain and source electrodes have been previously formed, additional openings in the first layer of photoresist are defined that approximately overlay the drain and source electrodes. A metal layer is then deposited on top of this structure. A second layer of photoresist is then deposited and photolithographically defined on top of the first metal layer, with larger openings which overlay the openings in the first layer of photoresist. The thickness of the gate electrode, and in one embodiment, the sections overlaying the drain and source electrodes, is then increased by plating gold into the openings in the second layer of photoresist.
公开/授权文献
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IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L29/00 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件(H01L31/00至H01L47/00,H01L51/05优先;除半导体或其电极之外的零部件入H01L23/00;由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00)
H01L29/66 .按半导体器件的类型区分的
H01L29/68 ..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的(H01L29/96优先)
H01L29/76 ...单极器件
H01L29/772 ....场效应晶体管
H01L29/80 .....由PN结或其他整流结栅产生场效应的
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