Invention Application
- Patent Title: UV LED Curable Hotmelt Pressure Sensitive Adhesive Composition
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Application No.: US18921467Application Date: 2024-10-21
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Publication No.: US20250043150A1Publication Date: 2025-02-06
- Inventor: Moritz Arnold , Andreas Taden , Anja Schneider , Thomas Roschkowski
- Applicant: Henkel AG & Co. KGaA
- Applicant Address: DE Düsseldorf
- Assignee: Henkel AG & Co. KGaA
- Current Assignee: Henkel AG & Co. KGaA
- Current Assignee Address: DE Düsseldorf
- Priority: EPEP22209896 20221128
- Main IPC: C09J4/00
- IPC: C09J4/00 ; C08K5/375 ; C08K5/46 ; C09J7/38 ; C09J133/06
Abstract:
The present invention refers to a UV LED curable hotmelt pressure sensitive adhesive composition, a method for its production as well as an article comprising a first substrate and a second substrate adhered to each other with the adhesive composition according to the invention.
Information query
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