Invention Publication
- Patent Title: BIPOLAR ELECTROSTATIC CHUCK ELECTRODE DESIGNS
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Application No.: US18158379Application Date: 2023-01-23
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Publication No.: US20240249924A1Publication Date: 2024-07-25
- Inventor: Jian Li , Kallol Bera , Edward P. Hammond , Dmitry A. Dzilno , Juan Carlos Rocha-Alvarez , Xiaopu Li
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01J37/32
- IPC: H01J37/32 ; C23C16/458 ; H01L21/683

Abstract:
Exemplary substrate support assemblies may include an electrostatic chuck body defining a substrate support surface that defines a substrate seat. The assemblies may include a support stem coupled with the electrostatic chuck body. The assemblies may include a first bipolar electrode embedded within the electrostatic chuck body. The assemblies may include a second bipolar electrode embedded within the electrostatic chuck body. An entirety of the second bipolar electrode may be radially inward of at least a portion of the first bipolar electrode. The first bipolar electrode and the second bipolar electrode may be coaxial with one another. Each of the first bipolar electrode and the second bipolar electrode may be coupled with at least one RF power supply. Each of the first bipolar electrode and the second bipolar electrode may be coupled with at least one DC power supply.
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