Invention Publication
- Patent Title: EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE
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Application No.: US17956338Application Date: 2022-09-29
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Publication No.: US20240114622A1Publication Date: 2024-04-04
- Inventor: Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Tarek A. Ibrahim , Cary Kuliasha , Siddharth K. Alur , Jung Kyu Han , Beomseok Choi , Russell K. Mortensen , Andrew Collins , Haobo Chen , Brandon C. Marin
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L23/498 ; H01L23/538 ; H01L23/64 ; H01L25/065 ; H05K3/00 ; H05K3/46
Abstract:
An electronic device includes a substrate including a core layer; a cavity formed in the core layer, wherein the cavity includes sidewalls plated with a conductive material; a prefabricated passive electronic component disposed in the cavity; and a cavity sidewall connection providing electrical continuity from the plated cavity sidewalls to a first surface of the substrate and to a second surface of the substrate.
Information query
