Invention Publication
- Patent Title: CHIP PACKAGE STRUCTURE WITH CONDUCTIVE SHIELDING FILM
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Application No.: US18388290Application Date: 2023-11-09
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Publication No.: US20240079381A1Publication Date: 2024-03-07
- Inventor: Chen-Hua YU , An-Jhih SU , Jing-Cheng LIN , Po-Hao TSAI
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- The original application number of the division: US16159816 2018.10.15
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L21/56 ; H01L21/78 ; H01L23/00 ; H01L23/31 ; H01L23/498 ; H01L23/552 ; H01L23/60 ; H01L25/00 ; H01L25/10
Abstract:
A chip package structure is provided. The chip package structure includes a chip structure. The chip package structure includes a first ground bump below the chip structure. The chip package structure includes a conductive shielding film disposed over the chip structure and extending onto the first ground bump. The conductive shielding film has a concave upper surface facing the first ground bump.
Information query
IPC分类:
