A method for forming a three-dimensional memory device can include forming a staircase structure. An alternating layer stack is disposed and etched to form steps. A continuous layer disposed on the staircase structure continuously extends over the steps. An insulating layer is disposed on the continuous layer and a slit is formed extending through the staircase structure. The slit exposes sidewalls of the continuous layer and the steps. The sacrificial layer is removed and a cavity is formed in place of the continuous layer. An etch stop layer is disposed in the cavity and continuously extends over the steps. Openings are formed through the insulating layer and expose a portion of a lateral surface of the etch stop layer. The openings are extended through the etch stop layer to expose a lateral surface of each step of the steps. Contacts are formed in the openings.