发明公开
- 专利标题: HEAT CONTROLLED SWITCH
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申请号: US17834944申请日: 2022-06-08
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公开(公告)号: US20230402241A1公开(公告)日: 2023-12-14
- 发明人: Yu-Wei Ting , Kuo-Pin Chang , Hung-Ju Li , Kuo-Ching Huang
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsinchu
- 主分类号: H01H37/12
- IPC分类号: H01H37/12 ; H01H37/32
摘要:
A semiconductor device is disclosed. The semiconductor device includes a semiconductor substrate, and a heater element on the semiconductor substrate, the heater element configured to generate heat in response to a current flowing therethrough. The semiconductor device also includes a conductor material having a programmable conductivity, and an insulator layer between the heater element and the conductor material, where the conductor material is configured to be programmed by applying one or more voltage differences to one or more of the heater element and the conductor material, and where a capacitance between the conductor material and the heater element is configured to be controlled by the voltage differences such that the capacitance is lower while the conductor material is being programmed than while the conductor material is not being programmed.
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